Search

Search:(Access key 2)

• Athens/Institution Login |
• Register |
• Forgot Password?

Home >  Browse > Journal Issue List

E-mail this page

Soldering & Surface Mount Technology

---

Articles

Articles

Article No:	Article Information:
1811447	Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective Kati Kokko, Hanna Harjunpää, Anna-Maija Haltia, Pekka Heino, Minna Kellomäki (pp. 4-11) Keywords: Adhesives, Coatings technology, Electrical conductivity, Joining materials, Materials with purpose ArticleType: Research paper View HTML | View PDF (262 KB) | Reprints & Permissions
1811448	Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints Martin Wickham, Ling Zou, Christopher Hunt (pp. 12-18) Keywords: Adhesives, Lead, Parts, Reliability management, Solders, Surface conductivity ArticleType: Research paper View HTML | View PDF (539 KB) | Reprints & Permissions
1811449	Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders T.K. Yeh, K.L. Lin, B. Salam (pp. 19-23) Keywords: Alloys, Alloys, Oxidation resistance, Silver, Solders ArticleType: Research paper View HTML | View PDF (430 KB) | Reprints & Permissions
1811450	On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters D. Di Maio, C.P. Hunt (pp. 24-31) Keywords: Alloys, Copper, Diffusion, Soldering, Solders ArticleType: Research paper View HTML | View PDF (414 KB) | Reprints & Permissions
1811451	Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno (pp. 32-37) Keywords: Alloys, Soldering, Solders, Thermal properties of materials ArticleType: Research paper View HTML | View PDF (465 KB) | Reprints & Permissions
1811452	Reflow profile optimization of µBGA solder joints considering reflow temperature and time coupling Tao Bo, Yin Zhouping, Ding Han, Wu Yiping (pp. 38-44) Keywords: Failure (mechanical), Joining materials, Reliability management, Soldering ArticleType: Research paper View HTML | View PDF (260 KB) | Reprints & Permissions
1811453	Local melt process of solder bumping by induction heating reflow Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung Kim (pp. 45-54) Keywords: Heating, Induction, Melting, Soldering ArticleType: Research paper View HTML | View PDF (537 KB) | Reprints & Permissions

Editorial

Editorial

Item No:	Item Information
1811454	Editorial Vol : 21 Issue: 4 Author(s): Martin Goosey View HTML

Industry news

SURFENERGY – a new European project to help the PCB and surface finishing sectors

Item No:	Item Information
1811455	SURFENERGY – a new European project to help the PCB and surface finishing sectors Vol : 21 Issue: 4 View HTML

Alpha appoints Solder Connection

Item No:	Item Information
1811456	Alpha appoints Solder Connection Vol : 21 Issue: 4 View HTML

Rehm Thermal Systems signs distribution agreement with ENCON in Poland

Item No:	Item Information
1811457	Rehm Thermal Systems signs distribution agreement with ENCON in Poland Vol : 21 Issue: 4 View HTML

CIL expands test facility

Item No:	Item Information
1811458	CIL expands test facility Vol : 21 Issue: 4 View HTML

Rehm Thermal Systems signs agreement with ONBoard Solutions in Australia and New Zealand

Item No:	Item Information
1811459	Rehm Thermal Systems signs agreement with ONBoard Solutions in Australia and New Zealand Vol : 21 Issue: 4 View HTML

Prodelectronic reaches an agreement with DEK to acquire the sales and manufacturing business in France

Item No:	Item Information
1811460	Prodelectronic reaches an agreement with DEK to acquire the sales and manufacturing business in France Vol : 21 Issue: 4 View HTML

DEK US-based stencil operations receive official ITAR registration

Item No:	Item Information
1811461	DEK US-based stencil operations receive official ITAR registration Vol : 21 Issue: 4 View HTML

OK International Soldering, Desoldering and Rework System wins again

Item No:	Item Information
1811462	OK International Soldering, Desoldering and Rework System wins again Vol : 21 Issue: 4 View HTML

International diary

International diary

Item No:	Item Information
1811463	International diary Vol : 21 Issue: 4 View HTML

Conferences and exhibitions

Lead-Free Solders and Emerging Interconnect and Packaging Technologies at the 138th TMS Annual Meeting and Exhibition, 16-19 February 2009, Moscone West Convention Center, San Francisco, California, USA

Item No:	Item Information
1811464	Lead-Free Solders and Emerging Interconnect and Packaging Technologies at the 138th TMS Annual Meeting and Exhibition, 16-19 February 2009, Moscone West Convention Center, San Francisco, California, USA Vol : 21 Issue: 4 Author(s): Professor Fu Guo View HTML

Printed Electronics Europe, 7-8 April 2009, Dresden, Germany

Item No:	Item Information
1811465	Printed Electronics Europe, 7-8 April 2009, Dresden, Germany Vol : 21 Issue: 4 Author(s): John Ling View HTML

SMT/Hybrid/Packaging, 5-7 May 2009, Nürnberg, Germany

Item No:	Item Information
1811466	SMT/Hybrid/Packaging, 5-7 May 2009, Nürnberg, Germany Vol : 21 Issue: 4 Author(s): John Ling View HTML

EIPC Summer Conference 2009, 18-19 June 2009

Item No:	Item Information
1811467	EIPC Summer Conference 2009, 18-19 June 2009 Vol : 21 Issue: 4 Author(s): Martin Goosey View HTML

New products

Siemens Electronics Assembly Systems introduces a placement machine with rail-mounted gantries that can be added or moved within only minutes

Item No:	Item Information
1811468	Siemens Electronics Assembly Systems introduces a placement machine with rail-mounted gantries that can be added or moved within only minutes Vol : 21 Issue: 4 View HTML

DEK launches Verification & Traceability Software Suite

Item No:	Item Information
1811469	DEK launches Verification & Traceability Software Suite Vol : 21 Issue: 4 View HTML

Verotec extend range of 19″ modular general purpose and EMC rack cases

Item No:	Item Information
1811470	Verotec extend range of 19″ modular general purpose and EMC rack cases Vol : 21 Issue: 4 View HTML

Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste

Item No:	Item Information
1811471	Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste Vol : 21 Issue: 4 View HTML

New sensor film range maps and measures extremely low-contact pressures

Item No:	Item Information
1811472	New sensor film range maps and measures extremely low-contact pressures Vol : 21 Issue: 4 View HTML

About Sensor Products Inc. (USA)

Item No:	Item Information
1811473	About Sensor Products Inc. (USA) Vol : 21 Issue: 4 View HTML

Intertronics Turbo-Coat – tack free in 3 min

Item No:	Item Information
1811474	Intertronics Turbo-Coat – tack free in 3 min Vol : 21 Issue: 4 View HTML

Book review

Nanopackaging: Nanotechnologies and Electronics Packaging

Item No:	Item Information
1811475	Nanopackaging: Nanotechnologies and Electronics Packaging Vol : 21 Issue: 4 Author(s): Martin Goosey View HTML