| 877324 |
Analysis and optimization of the thermal performance of microchannel heat sinks
Dong Liu, Suresh V. Garimella
(pp. 7-26)
Keywords:
Convection,
Heat transfer,
Optimization techniques
ArticleType: Technical paper
View HTML
|
View PDF
(190 KB)
| Reprints & Permissions
|
| 877325 |
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid, Z.A. Zainal
(pp. 27-42)
Keywords:
Finite element analysis,
Optimization techniques,
Thermal resistance
ArticleType: Technical paper
View HTML
|
View PDF
(342 KB)
| Reprints & Permissions
|
| 877326 |
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
Pradeep Hegde, K.N. Seetharamu, G.A. Quadir, P.A. Aswathanarayana, M.Z. Abdullah, Z.A. Zainal
(pp. 43-60)
Keywords:
Finite element analysis,
Flow,
Pressure,
Thermal resistance
ArticleType: Technical paper
View HTML
|
View PDF
(401 KB)
| Reprints & Permissions
|
| 877327 |
Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages
Ravi Kandasamy, Suresh Subramanyam
(pp. 61-72)
Keywords:
Fluid dynamics,
Simulation,
Thermal measurement,
Thermal resistance
ArticleType: Technical paper
View HTML
|
View PDF
(946 KB)
| Reprints & Permissions
|
| 877328 |
Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme
P. Nithiarasu, N. Massarotti, J.S. Mathur
(pp. 73-95)
Keywords:
Convection,
Heat transfer,
Solder
ArticleType: Research paper
View HTML
|
View PDF
(2552 KB)
| Reprints & Permissions
|
| 877329 |
Steady and unsteady thermal analysis of a triple stack cold plate with heat losses
Shiao Lin Beh, C.K. Ooi, G.A. Quadir, K.N. Seetharamu
(pp. 96-112)
Keywords:
Cooling,
Electronic equipment and components,
Finite element analysis,
Heat loss
ArticleType: Technical paper
View HTML
|
View PDF
(497 KB)
| Reprints & Permissions
|
Logout
Backfiles 
EarlyCite