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Circuit World

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Articles

Articles

Article No:	Article Information:
1464705	An overview of digital printing for advanced interconnect applications Thomas Sutter (pp. 4-9) Keywords: Image processing, Inkjet printers, Manufacturing industries, Printed-circuit boards ArticleType: General review View HTML | View PDF (1264 KB) | Reprints & Permissions
1464706	A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images S.M. Hyslop, P.J. Palmer, D.C. Whalley (pp. 10-16) Keywords: Assembly, Printed-circuit-boards, Process efficiency ArticleType: Research paper View HTML | View PDF (526 KB) | Reprints & Permissions
1464707	SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards Taehoon Kim, Jee-Soo Mok, Chang-Kyu Song, Jun-Heyoung Park, Kyung-O Kim, Ben Sun, Byung-Youl Min (pp. 17-20) Keywords: Assembly, Laminates, Printed-circuit boards ArticleType: Technical paper View HTML | View PDF (396 KB) | Reprints & Permissions
1464708	New technologies for a sustainable printed circuit board manufacturing process: initial results Narinder Bains, Kate Geraghty, Martin Goosey (pp. 21-25) Keywords: Manufacturing industries, Printed-circuit boards, Sustainable development ArticleType: Research paper View HTML | View PDF (272 KB) | Reprints & Permissions
1464709	Environmental and economic implications of a shift to halogen-free printed wiring boards Carl Gunnar Bergendahl, Kerstin Lichtenvort, Glenn Johansson, Mats Zackrisson, Jonna Nyyssönen (pp. 26-31) Keywords: Electronics industry, European directives, Printed-circuit boards, Sustainable development ArticleType: Technical paper View HTML | View PDF (439 KB) | Reprints & Permissions
1464710	Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys Dezhi Li, Changqing Liu, Paul P. Conway (pp. 32-39) Keywords: Alloys, Coating processes, Soldering ArticleType: Research paper View HTML | View PDF (1057 KB) | Reprints & Permissions
1464711	Soldering considerations for lead-free printed circuit board assembly – an Envirowise Guide Martin Goosey (pp. 40-44) Keywords: Assembly, Printed-circuit boards, Soldering ArticleType: General review View HTML | View PDF (298 KB) | Reprints & Permissions

Editorial

Editorial

Item No:	Item Information
1501260	Editorial Journal: Circuit World Vol : 31 Issue: 3 Author(s): Martin Goosey View HTML

Association news

SMART group present cheque to MND Charity

Item No:	Item Information
1501261	SMART group present cheque to MND Charity Journal: Circuit World Vol : 31 Issue: 3 View HTML

IPC's Government Relations Steering Committee made stronger with addition of two industry leaders

Item No:	Item Information
1501262	IPC's Government Relations Steering Committee made stronger with addition of two industry leaders Journal: Circuit World Vol : 31 Issue: 3 View HTML

Appointments

Stuart Down Heads Coa Tes Circuit Products in North America

Item No:	Item Information
1501263	Stuart Down Heads Coa Tes Circuit Products in North America Journal: Circuit World Vol : 31 Issue: 3 View HTML

Chris Milton appointed general manager for Rohm & Haas Circuit Board Technologies in Europe

Item No:	Item Information
1501264	Chris Milton appointed general manager for Rohm & Haas Circuit Board Technologies in Europe Journal: Circuit World Vol : 31 Issue: 3 View HTML

AvW Group gains Oblak for Management

Item No:	Item Information
1501265	AvW Group gains Oblak for Management Journal: Circuit World Vol : 31 Issue: 3 View HTML

Huub van Dun appointed president of Enthone Inc.

Item No:	Item Information
1501266	Huub van Dun appointed president of Enthone Inc. Journal: Circuit World Vol : 31 Issue: 3 View HTML

Industry news

NPL seeks partners for new reliability project for lead-free processed substrates

Item No:	Item Information
1501267	NPL seeks partners for new reliability project for lead-free processed substrates Journal: Circuit World Vol : 31 Issue: 3 View HTML

Are electronics companies on target for lead-free RoHS deadlines?

Item No:	Item Information
1501268	Are electronics companies on target for lead-free RoHS deadlines? Journal: Circuit World Vol : 31 Issue: 3 View HTML

Rohm and Haas announces corporate gift for Tsunami survivors

Item No:	Item Information
1501269	Rohm and Haas announces corporate gift for Tsunami survivors Journal: Circuit World Vol : 31 Issue: 3 View HTML

Soldertec Global announces winners of Lead-Free Solder Awards 2004

Item No:	Item Information
1501270	Soldertec Global announces winners of Lead-Free Solder Awards 2004 Journal: Circuit World Vol : 31 Issue: 3 View HTML

ISOLA Group completes European restructuring plan

Item No:	Item Information
1501271	ISOLA Group completes European restructuring plan Journal: Circuit World Vol : 31 Issue: 3 View HTML

DTI Faraday Mini-Waste Members secure additional funding to develop new advanced oxidation technology

Item No:	Item Information
1501272	DTI Faraday Mini-Waste Members secure additional funding to develop new advanced oxidation technology Journal: Circuit World Vol : 31 Issue: 3 View HTML

Lead-free and RoHS developments in China

Item No:	Item Information
1501273	Lead-free and RoHS developments in China Journal: Circuit World Vol : 31 Issue: 3 View HTML

ACI waterborne photoresists to be assessed

Item No:	Item Information
1501274	ACI waterborne photoresists to be assessed Journal: Circuit World Vol : 31 Issue: 3 View HTML

AT&S selects Camtek's Dragon with Kuttler's material handling for fully automatic optical inspection lines

Item No:	Item Information
1501275	AT&S selects Camtek's Dragon with Kuttler's material handling for fully automatic optical inspection lines Journal: Circuit World Vol : 31 Issue: 3 View HTML

Orbotech receives major order from LG Electronics for PCB manufacturing operation

Item No:	Item Information
1501276	Orbotech receives major order from LG Electronics for PCB manufacturing operation Journal: Circuit World Vol : 31 Issue: 3 View HTML

Legislation update

Item No:	Item Information
1501277	Legislation update Journal: Circuit World Vol : 31 Issue: 3 Author(s): Kate Geraghty View HTML

International diary

International diary

Item No:	Item Information
1501278	International diary Journal: Circuit World Vol : 31 Issue: 3 View HTML

New products

New DuPont™ Zytel® HTN resins smooth the path to lead-free circuit assembly

Item No:	Item Information
1501279	New DuPont™ Zytel® HTN resins smooth the path to lead-free circuit assembly Journal: Circuit World Vol : 31 Issue: 3 View HTML

Excellon Automation announces the release of its Concept 129 Precision Driller/Router

Item No:	Item Information
1501280	Excellon Automation announces the release of its Concept 129 Precision Driller/Router Journal: Circuit World Vol : 31 Issue: 3 View HTML

Book reviews

Planar Microwave Engineering: A Practical guide to Theory, Measurement and Circuits

Item No:	Item Information
1501281	Planar Microwave Engineering: A Practical guide to Theory, Measurement and Circuits Journal: Circuit World Vol : 31 Issue: 3 View HTML

Starting Electronics

Item No:	Item Information
1501282	Starting Electronics Journal: Circuit World Vol : 31 Issue: 3 View HTML

Intellect commentary

Market and government forces

Item No:	Item Information
1501283	Market and government forces Journal: Circuit World Vol : 31 Issue: 3 Author(s): Frank Coultard View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1501284	Internet commentary Journal: Circuit World Vol : 31 Issue: 3 Author(s): Brian Ellis View HTML