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Microelectronics International


Volume 22 Issue 2

Published: 2005 | Start Page: 3

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Articles

Articles
Article No: Article Information:
1464723 Thick/thin film thermocouples as power source for autonomous microsystems – preliminary results
P. Markowski, A. Dziedzic, E. Prociow (pp. 3-7)
Keywords: Electric power systems, Thermoelectric devices
ArticleType: Research paper
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1464724 A 3D miniaturised programmable transceiver
Brendan O'Flynn, S. Bellis, K. Mahmood, M. Morris, G. Duffy, K. Delaney, C. O'Mathuna (pp. 8-12)
Keywords: Electric power transmission, Sensors, Transceivers
ArticleType: Research paper
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1464725 Properties of PZT thick films made on LTCC
L.J. Golonka, M. Buczek, M. Hrovat, D. Belavic, A. Dziedzic, H. Roguszczak, T. Zawada (pp. 13-16)
Keywords: Actuators, Electrical properties, Thick-film circuits
ArticleType: Research paper
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1464726 Chip packaging challenges … a roadmap based overview
Andy Longford (pp. 17-20)
Keywords: Electronics industry, Semiconductor technology
ArticleType: Viewpoint
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1464727 Reliability assessment for SnPb solder and Ag-Pd bond pad metallization
Kiat Choon Teo, Yu Lin Ting (pp. 21-27)
Keywords: Solders, Temperature measurement, Tests and testing
ArticleType: Literature review
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1464728 Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate
Marc van Kleef, Jeroen Bielen, Jan Gülpen, Mike Ramos (pp. 28-34)
Keywords: Laminates, Moisture measurement, Solder
ArticleType: Research paper
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1464729 A faster power MOSFET device with electrical stress treatment
C. Salame, R. Habchi, W. Tazibt, A. Khoury, P. Mialhe (pp. 35-37)
Keywords: Semiconductors, Stress (materials)
ArticleType: Research paper
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Book Review

Starting Electronics
Item No: Item Information
1464721 Starting Electronics
Journal: Microelectronics International
Vol : 22 Issue: 2
Author(s): Brian Ellis
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Planar Microwave Engineering: A Practical Guide to Theory, Measurement and Circuits
Item No: Item Information
1464722 Planar Microwave Engineering: A Practical Guide to Theory, Measurement and Circuits
Journal: Microelectronics International
Vol : 22 Issue: 2
Author(s): Brian Ellis
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Industry news

Hewitt offers £80 million investment in world-beating technologies
Item No: Item Information
1501305 Hewitt offers £80 million investment in world-beating technologies
Journal: Microelectronics International
Vol : 22 Issue: 2
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WiMAX Forum™ selects Cetecom Spain to begin certification testing in July 2005
Item No: Item Information
1501306 WiMAX Forum™ selects Cetecom Spain to begin certification testing in July 2005
Journal: Microelectronics International
Vol : 22 Issue: 2
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NuSil Technology appoints new distributors in Europe and Middle East
Item No: Item Information
1501307 NuSil Technology appoints new distributors in Europe and Middle East
Journal: Microelectronics International
Vol : 22 Issue: 2
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Finisar to acquire Infineon fibre optic transceiver business; Infineon to retain POF, parallel optics and FTTH
Item No: Item Information
1501308 Finisar to acquire Infineon fibre optic transceiver business; Infineon to retain POF, parallel optics and FTTH
Journal: Microelectronics International
Vol : 22 Issue: 2
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Agilent Technologies to acquire Wavics, leading provider of innovative power amplifiers for mobile handset market
Item No: Item Information
1501309 Agilent Technologies to acquire Wavics, leading provider of innovative power amplifiers for mobile handset market
Journal: Microelectronics International
Vol : 22 Issue: 2
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Agilent Technologies introduces industry's fastest infrared transceivers for mobile phones and PDAs
Item No: Item Information
1501310 Agilent Technologies introduces industry's fastest infrared transceivers for mobile phones and PDAs
Journal: Microelectronics International
Vol : 22 Issue: 2
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Germany and UK set to drive $1bn west European RFID market by 2007
Item No: Item Information
1501311 Germany and UK set to drive $1bn west European RFID market by 2007
Journal: Microelectronics International
Vol : 22 Issue: 2
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Exhibitions and conferences

Microtech 2005
Item No: Item Information
1501312 Microtech 2005
Journal: Microelectronics International
Vol : 22 Issue: 2
Author(s): John Ling
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International diary

International diary
Item No: Item Information
1501313 International diary
Journal: Microelectronics International
Vol : 22 Issue: 2
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New products

EPCOS components
Item No: Item Information
1501314 EPCOS components
Journal: Microelectronics International
Vol : 22 Issue: 2
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Agilent technologies' Industry-first +95°C fiber-optic transmitter-receiver
Item No: Item Information
1501315 Agilent technologies' Industry-first +95°C fiber-optic transmitter-receiver
Journal: Microelectronics International
Vol : 22 Issue: 2
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Agilent's AFBR-1010 fibre-optic transmitter and AFBR-2010 receiver
Item No: Item Information
1501316 Agilent's AFBR-1010 fibre-optic transmitter and AFBR-2010 receiver
Journal: Microelectronics International
Vol : 22 Issue: 2
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New UV-cure encapsulants from Henkel
Item No: Item Information
1501317 New UV-cure encapsulants from Henkel
Journal: Microelectronics International
Vol : 22 Issue: 2
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Agilent Technologies introduces next-generation FBAR transmit filter for US PCS band mobile phones, data cards
Item No: Item Information
1501318 Agilent Technologies introduces next-generation FBAR transmit filter for US PCS band mobile phones, data cards
Journal: Microelectronics International
Vol : 22 Issue: 2
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Interviews

Dr Peter Barnwell
Item No: Item Information
1501319 Dr Peter Barnwell
Journal: Microelectronics International
Vol : 22 Issue: 2
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New Chairman for iMaps UK
Item No: Item Information
1501320 New Chairman for iMaps UK
Journal: Microelectronics International
Vol : 22 Issue: 2
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Internet commentary

The medium is the message
Item No: Item Information
1501321 The medium is the message
Journal: Microelectronics International
Vol : 22 Issue: 2
Author(s): Brian Ellis
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