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Soldering & Surface Mount Technology


Volume 17 Issue 2

Published: 2005 | Start Page: 3

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Articles

Articles
Article No: Article Information:
1501776 Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thickness
Joon Kwon Moon, Y. Zhou, Jae Pil Jung (pp. 3-9)
Keywords: Joining processes, Organometallic compounds, Soldering, Strength of materials
ArticleType: Research paper
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1501777 Microstructural investigation of lead-free BGAs soldered with tin-lead solder
Günter Grossmann, Joy Tharian, Pascal Jud, Urs Sennhauser (pp. 10-21)
Keywords: Lead, Metals, Solder, Soldering
ArticleType: Research paper
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1501778 The impact of thermal cycling regime on the shear strength of lead-free solder joints
Milos Dusek, Martin Wickham, Christopher Hunt (pp. 22-31)
Keywords: Joining processes, Reliability management, Solders, Strength of materials
ArticleType: Research paper
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1501779 A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environment
Girish S. Wable, Quyen Chu, Purushothaman Damodaran, Krishnaswami Srihari (pp. 32-39)
Keywords: Electronics industry, Joining processes, Solder
ArticleType: Research paper
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1501780 The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing
M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu, A. Sharif (pp. 40-48)
Keywords: Adhesion, Ageing (materials), Films (states of matter), Strength of materials
ArticleType: Research paper
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Letter to the editor

Letter to the editor
Item No: Item Information
1501781 Letter to the editor
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Industry news

CorinTech awarded BSI Kitemark IPC-A-610C licence
Item No: Item Information
1501782 CorinTech awarded BSI Kitemark IPC-A-610C licence
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Contax helps MRP electronics eliminate micro-cracking
Item No: Item Information
1501783 Contax helps MRP electronics eliminate micro-cracking
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Axiom fly the UK’s first lead-free Kitemark
Item No: Item Information
1501784 Axiom fly the UK’s first lead-free Kitemark
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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eXception Group Limited acquire certain DDi Europe businesses
Item No: Item Information
1501785 eXception Group Limited acquire certain DDi Europe businesses
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Universal Instruments’ exemplary customer service receives a Frost & Sullivan Award
Item No: Item Information
1501786 Universal Instruments’ exemplary customer service receives a Frost & Sullivan Award
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Universal Instruments named a “Most Influential Enterprise” in China
Item No: Item Information
1501787 Universal Instruments named a “Most Influential Enterprise” in China
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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DEK and Stork join forces to develop electroform stencils for SMT industry
Item No: Item Information
1501788 DEK and Stork join forces to develop electroform stencils for SMT industry
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Jaltek Systems – process control equals product quality
Item No: Item Information
1501789 Jaltek Systems – process control equals product quality
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Appointments

New product manager for DEK European Distributed Products (Consumables)
Item No: Item Information
1501790 New product manager for DEK European Distributed Products (Consumables)
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Exhibitions and conferences

SSTC Winter Conference concentrates on lead-free solder reliability
Item No: Item Information
1501791 SSTC Winter Conference concentrates on lead-free solder reliability
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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SMART Group 7th Annual Lead Free Conference, High Wycombe, Buckinghamshire, 3 February 2005
Item No: Item Information
1501792 SMART Group 7th Annual Lead Free Conference, High Wycombe, Buckinghamshire, 3 February 2005
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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EIPC Winter Conference, Barcelona, Spain, 27-28 January 2005
Item No: Item Information
1501793 EIPC Winter Conference, Barcelona, Spain, 27-28 January 2005
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
Author(s): John Ling
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International diary

International diary
Item No: Item Information
1501794 International diary
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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New products

Contax announces Speedline next generation stencil printer
Item No: Item Information
1501795 Contax announces Speedline next generation stencil printer
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Online maintenance gets even more Interactiv™
Item No: Item Information
1501796 Online maintenance gets even more Interactiv™
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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INTERTRONICS launch Permalex Squeegees to improve printing with lead-free paste
Item No: Item Information
1501797 INTERTRONICS launch Permalex Squeegees to improve printing with lead-free paste
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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New high-power X-ray target from FEINFOCUS
Item No: Item Information
1501798 New high-power X-ray target from FEINFOCUS
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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New zero defects testing system
Item No: Item Information
1501799 New zero defects testing system
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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New flexible pick and place from Contax
Item No: Item Information
1501800 New flexible pick and place from Contax
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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New thermally conductive, electrically insulating epoxy resists up to 500°F
Item No: Item Information
1501801 New thermally conductive, electrically insulating epoxy resists up to 500°F
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Henkel introduces new low temperature cure, lead-free compatible surface mount adhesive
Item No: Item Information
1501802 Henkel introduces new low temperature cure, lead-free compatible surface mount adhesive
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Henkel's lead-free solder paste exhibits exceptional humidity resistance
Item No: Item Information
1501803 Henkel's lead-free solder paste exhibits exceptional humidity resistance
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Book reviews

Starting Electronics
Item No: Item Information
1501804 Starting Electronics
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
Author(s): Brian Ellis
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Planar Microwave Engineering: A Practical Guide to Theory, Measurement and Circuits
Item No: Item Information
1501805 Planar Microwave Engineering: A Practical Guide to Theory, Measurement and Circuits
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
Author(s): Brian Ellis
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Implementing Lead-Free Electronics
Item No: Item Information
1501806 Implementing Lead-Free Electronics
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
Author(s): Bob Willis
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IC Component Sockets
Item No: Item Information
1501807 IC Component Sockets
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Publications

Lead-Free Solder Interconnect Reliability
Item No: Item Information
1501808 Lead-Free Solder Interconnect Reliability
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Obituary

Professor Eero Ristolainen
Item No: Item Information
1501809 Professor Eero Ristolainen
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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Internet commentary

A certain fox, it is said, wanted to become a wolf
Item No: Item Information
1501810 A certain fox, it is said, wanted to become a wolf
Journal: Soldering & Surface Mount Technology
Vol : 17 Issue: 2
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