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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1509646	The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints Meng-Kuang Huang, Chiapyng Lee, Pei-Lin Wu, Shyh-Rong Tzan (pp. 3-8) Keywords: Fatigue, Reliability management, Soldering, Strength of materials, Surface properties of materials ArticleType: Research paper View HTML | View PDF (680 KB) | Reprints & Permissions
1509647	Effect of SnAgCu composition on soldering performance Benlih Huang, Arnab Dasgupta, Ning-Cheng Lee (pp. 9-19) Keywords: Assembly, Solder, Soldering, Surface treatment ArticleType: Research paper View HTML | View PDF (971 KB) | Reprints & Permissions
1509648	The effect of thermal cycling on the contact resistance of anisotropic conductive joints L. Ali, Y.C. Chan, M.O. Alam (pp. 20-31) Keywords: Reliability management, Joining processes, Thermal resistance ArticleType: Research paper View HTML | View PDF (527 KB) | Reprints & Permissions
1509649	Solder joint reliability in AgPt-metallized LTCC modules Olli Nousiaianen, Risto Rautioaho, Kari Kautio, Jussi Jääskeläinen, Seppo Leppävuori (pp. 32-42) Keywords: Ceramics, Joining processes, Modelling, Reliability management, Solders ArticleType: Research paper View HTML | View PDF (476 KB) | Reprints & Permissions
1509650	Application of a design of experiments approach to the reliability of a PBGA package Ji Hyuck Yang, Kang Yong Lee (pp. 43-53) Keywords: Reliability management, Soldering, Stress (materials) ArticleType: Research paper View HTML | View PDF (353 KB) | Reprints & Permissions

Book Review

Handbook of Thick Film Technology – 2nd edition

Item No:	Item Information
1509645	Handbook of Thick Film Technology – 2nd edition Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 Author(s): Brian Ellis View HTML

Industry news

Accelonix expands with three new distributor deals for the UK

Item No:	Item Information
1509651	Accelonix expands with three new distributor deals for the UK Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

DfR Solutions and Interface Sciences Corporation team up to provide solutions for conductive anodic filament (CAF) formation and Pb-free reflow

Item No:	Item Information
1509652	DfR Solutions and Interface Sciences Corporation team up to provide solutions for conductive anodic filament (CAF) formation and Pb-free reflow Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 Author(s): Dr Craig Hillman View HTML

Appointments

DEK's Neil MacRaild named Americas General Manager

Item No:	Item Information
1509653	DEK's Neil MacRaild named Americas General Manager Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Henkel promotes Giuseppe Caramella to Product Manager for Europe

Item No:	Item Information
1509654	Henkel promotes Giuseppe Caramella to Product Manager for Europe Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Exhibitions and conferences

NEPCON 2005

Item No:	Item Information
1509655	NEPCON 2005 Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 Author(s): John Ling View HTML

International diary

International diary

Item No:	Item Information
1509656	International diary Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

New products

Contax launches C5 placement systems

Item No:	Item Information
1509657	Contax launches C5 placement systems Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Master Bond Inc. introduces new one part thermally conductive, electrically insulative silicone system

Item No:	Item Information
1509658	Master Bond Inc. introduces new one part thermally conductive, electrically insulative silicone system Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Contax announces the next generation of network compatible AOI

Item No:	Item Information
1509659	Contax announces the next generation of network compatible AOI Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Thermo Electron's ARL QUANT'X EDXRF spectrometer complies with new RoHS and WEEE regulations

Item No:	Item Information
1509660	Thermo Electron's ARL QUANT'X EDXRF spectrometer complies with new RoHS and WEEE regulations Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Intertronics launch lightweight, cordless electric hand-held dispenser

Item No:	Item Information
1509661	Intertronics launch lightweight, cordless electric hand-held dispenser Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Henkel Corporation introduces new conductive adhesive for die attach applications

Item No:	Item Information
1509662	Henkel Corporation introduces new conductive adhesive for die attach applications Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Pb-free screen printing study recommends more nickel in future stencils

Item No:	Item Information
1509663	Pb-free screen printing study recommends more nickel in future stencils Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Henkel Corporation introduces several innovative liquid fluxes for today's most demanding applications

Item No:	Item Information
1509664	Henkel Corporation introduces several innovative liquid fluxes for today's most demanding applications Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Interview

New chairman for iMAPS UK

Item No:	Item Information
1509665	New chairman for iMAPS UK Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1509666	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 17 Issue: 3 Author(s): Brian Ellis View HTML