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Microelectronics International

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Articles

Articles

Article No:	Article Information:
1550663	Test chip and substrate design for flip chip microelectronic package thermal measurements Teck Joo Goh, Chia-Pin Chiu, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal (pp. 3-10) Keywords: Finite element analysis, Printed circuits, Tests and testing, Thermal testing ArticleType: Research paper View HTML | View PDF (542 KB) | Reprints & Permissions
1550664	A study of aluminium wire failure in automotive under-hood applications Sung Yi, Sang Kyoo Park, Kiat Choon Teo (pp. 11-20) Keywords: Automotive industry, Electronic equipment and components, Product reliability ArticleType: Research paper View HTML | View PDF (1330 KB) | Reprints & Permissions
1550665	Temperature dependence of silicon power MOSFETs switching parameters R. Habchi, C. Salame, B. Nsouli, P. Mialhe (pp. 21-23) Keywords: Electric current, Field-effect transistors, Temperature ArticleType: Research paper View HTML | View PDF (143 KB) | Reprints & Permissions
1550666	Voltage mode multifunction OTA-C biquad filter K. Kumar, K. Pal (pp. 24-27) Keywords: Amplifiers, Printed circuits ArticleType: Research paper View HTML | View PDF (149 KB) | Reprints & Permissions
1550667	Low voltage CCII-based high performance cascadable multifunctional filter T. Parveen, S.S. Rajput, M.T. Ahmad (pp. 28-31) Keywords: Circuit properties, Electric filters, Low voltage ArticleType: Research paper View HTML | View PDF (143 KB) | Reprints & Permissions
1550668	Uprating of electronic parts to address obsolescence Michael Pecht, Dave Humphrey (pp. 32-36) Keywords: Electronic equipment and components, Obsolescence, Semiconductors ArticleType: Research paper View HTML | View PDF (80 KB) | Reprints & Permissions
1550669	Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life K.O. Lee, K.E. Ong, K.N. Seetharamu, I.A. Azid, G.A. Quadir, T.J. Goh (pp. 37-44) Keywords: Joining materials, Reliability management, Solders ArticleType: Research paper View HTML | View PDF (876 KB) | Reprints & Permissions
1550670	Impact of environmental regulations on green electronics manufacture Richard Ciocci, Michael Pecht (pp. 45-50) Keywords: Electronics industry, Environmental management ArticleType: Conceptual paper View HTML | View PDF (84 KB) | Reprints & Permissions

Industry news

Daresbury move brings Norcott Technologies closer to Innovators

Item No:	Item Information
1550671	Daresbury move brings Norcott Technologies closer to Innovators Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

New focused web site developed to speed up the LabVIEW recruitment process

Item No:	Item Information
1550672	New focused web site developed to speed up the LabVIEW recruitment process Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Nikon ships world's first production immersion system

Item No:	Item Information
1550673	Nikon ships world's first production immersion system Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Advance Nanotech Partners with Alps and Dow Corning Corporation to Finance New Wireless Research

Item No:	Item Information
1550674	Advance Nanotech Partners with Alps and Dow Corning Corporation to Finance New Wireless Research Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Bookham to highlight expanded high power laser diode portfolio at Photonics West 2006

Item No:	Item Information
1550675	Bookham to highlight expanded high power laser diode portfolio at Photonics West 2006 Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Omron Electronic Components Business – Europe completes RoHS compliance process

Item No:	Item Information
1550676	Omron Electronic Components Business – Europe completes RoHS compliance process Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Multiprocessor software specialist launches unified development platform for FPGAs and DSPs

Item No:	Item Information
1550677	Multiprocessor software specialist launches unified development platform for FPGAs and DSPs Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Quasicrystal technology to boost high-brightness LED market

Item No:	Item Information
1550678	Quasicrystal technology to boost high-brightness LED market Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

SENSOR+TEST 2006 – the measurement fair

Item No:	Item Information
1550679	SENSOR+TEST 2006 – the measurement fair Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

The conference programme for 2006

Item No:	Item Information
1550680	The conference programme for 2006 Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Pour encourager les autres: Microelectronics expands in France

Item No:	Item Information
1550681	Pour encourager les autres: Microelectronics expands in France Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Appointments

MnD appoints Ian Walsh as CEO

Item No:	Item Information
1550682	MnD appoints Ian Walsh as CEO Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Multi-Contact management change

Item No:	Item Information
1550683	Multi-Contact management change Journal: Microelectronics International Vol : 23 Issue: 2 View HTML

Exhibitions and conferences

Microtech 2006, iMAPS UK Technical Conference, Moeller Centre, Cambridge, March 7 and 8, 2006

Item No:	Item Information
1550684	Microtech 2006, iMAPS UK Technical Conference, Moeller Centre, Cambridge, March 7 and 8, 2006 Journal: Microelectronics International Vol : 23 Issue: 2 Author(s): J.H. Ling View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1550685	Internet commentary Journal: Microelectronics International Vol : 23 Issue: 2 Author(s): Brian Ellis View HTML