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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1550687	Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan, Johan Liu (pp. 4-11) Keywords: Fatigue, Finite element analysis, Joining materials, Simulation, Solders ArticleType: Research paper View HTML | View PDF (897 KB) | Reprints & Permissions
1550688	High strain rate testing of solder interconnections K.T. Tsai, F-L. Liu, E.H. Wong, R. Rajoo (pp. 12-17) Keywords: Electronic engineering, Joining processes, Reliability management, Solders ArticleType: Research paper View HTML | View PDF (551 KB) | Reprints & Permissions
1550689	Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging Li-Yin Hsiao, Jenq-Gong Duh (pp. 18-26) Keywords: Electrical connections, Metallurgy, Organometallic compounds, Solders ArticleType: Research paper View HTML | View PDF (2104 KB) | Reprints & Permissions
1550690	Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly C.Y. Yin, H. Lu, C. Bailey, Y.C. Chan (pp. 27-32) Keywords: Electrical connections, Modelling, Moisture ArticleType: Research paper View HTML | View PDF (923 KB) | Reprints & Permissions
1550691	High performance anisotropic conductive adhesives for lead-free interconnects Yi Li, C.P. Wong (pp. 33-39) Keywords: Adhesives, Electronic engineering, Joining materials, Thermal stability ArticleType: Research paper View HTML | View PDF (836 KB) | Reprints & Permissions
1550692	Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder Masahiro Inoue, Katsuaki Suganuma (pp. 40-45) Keywords: Adhesives, Cooling, Electrical properties, Epoxy resins, Stress (materials) ArticleType: Research paper View HTML | View PDF (448 KB) | Reprints & Permissions
1550693	Finite element analysis of fleXBGA reliability Gang Chen, Xu Chen (pp. 46-53) Keywords: Electronics industry, Finite element analysis, Optimization techniques, Reliability management, Solders ArticleType: Research paper View HTML | View PDF (567 KB) | Reprints & Permissions

Book Review

Lead-Free Solder Interconnection Reliability

Item No:	Item Information
1550686	Lead-Free Solder Interconnection Reliability Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging Author(s): Bob Willis View HTML

Guest editorial

Guest editorial

Item No:	Item Information
1550694	Guest editorial Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging Author(s): Chris Bailey, Johan Liu View HTML

Industry news

Norcott EMS and Miranda Technologies conclude successful lead free PCB trials

Item No:	Item Information
1550695	Norcott EMS and Miranda Technologies conclude successful lead free PCB trials Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Soldertec Global announces winners of lead free solder awards 2005

Item No:	Item Information
1550696	Soldertec Global announces winners of lead free solder awards 2005 Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

IPC SPVC announces research paper on solder joint voids for lead free solder

Item No:	Item Information
1550697	IPC SPVC announces research paper on solder joint voids for lead free solder Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Changes at Multiline and mie

Item No:	Item Information
1550698	Changes at Multiline and mie Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Contax installs new SMT line for Chemigraphic

Item No:	Item Information
1550699	Contax installs new SMT line for Chemigraphic Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

DEK sweeps industry awards mass imaging leader takes top honors in three prestigious contests

Item No:	Item Information
1550700	DEK sweeps industry awards mass imaging leader takes top honors in three prestigious contests Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Siemens wins Global Technology Award

Item No:	Item Information
1550701	Siemens wins Global Technology Award Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Appointments

Universal Instruments boosts Genesis Platform Team with new appointments

Item No:	Item Information
1550702	Universal Instruments boosts Genesis Platform Team with new appointments Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Projects manager appointed by Jaltek

Item No:	Item Information
1550703	Projects manager appointed by Jaltek Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

New strategic manager for leading EMS cooperation

Item No:	Item Information
1550704	New strategic manager for leading EMS cooperation Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Universal Instruments appoints new director for Europe

Item No:	Item Information
1550705	Universal Instruments appoints new director for Europe Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Exhibitions and conferences

EIPC Winter Conference 2006, January 26 and 27, Budapest, Hungary

Item No:	Item Information
1550706	EIPC Winter Conference 2006, January 26 and 27, Budapest, Hungary Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

The Smart Group 8th Annual Leadfree Seminar – February 16, 2006

Item No:	Item Information
1550707	The Smart Group 8th Annual Leadfree Seminar – February 16, 2006 Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

International diary

International diary

Item No:	Item Information
1550708	International diary Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

New products

Power spray cleaning from Contax

Item No:	Item Information
1550709	Power spray cleaning from Contax Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Solbraze solder pots sweep dross away for perfect tinning

Item No:	Item Information
1550710	Solbraze solder pots sweep dross away for perfect tinning Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging View HTML

Internet commentary

And, in the last analysis, he is on the side of those with plenty of money

Item No:	Item Information
1550711	And, in the last analysis, he is on the side of those with plenty of money Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 2 Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging Author(s): Brian Ellis View HTML