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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1563189	A novel crack and delamination protection mechanism for a WLCSP using soft joint technology Ming-Chih Yew, Chien-Chia Chiu, Shu-Ming Chang, Kuo-Ning Chiang (pp. 3-13) Keywords: Printed circuits, Simulation, Solder ArticleType: Research paper View HTML | View PDF (1794 KB) | Reprints & Permissions
1563190	Learning from the migration to lead-free solder Richard Ciocci, Michael Pecht (pp. 14-18) Keywords: Electronic engineering, Solder ArticleType: Conceptual paper View HTML | View PDF (74 KB) | Reprints & Permissions
1563191	Minimizing flux spatter during lead-free reflow assembly Deepak Manjunath, Satyanarayan Iyer, Shawn Eckel, Purushothaman Damodaran, Krishnaswami Srihari (pp. 19-23) Keywords: Electronics industry, Solders, Waste management ArticleType: Research paper View HTML | View PDF (1090 KB) | Reprints & Permissions
1563192	Dissolution of stainless steels in molten lead-free solders Tadashi Takemoto, Masaharu Takemoto (pp. 24-30) Keywords: Erosion, Solder, Soldering, Stainless steel ArticleType: Research paper View HTML | View PDF (1944 KB) | Reprints & Permissions
1563193	Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA) D.D. Hillman, L.S. Chumbley (pp. 31-41) Keywords: Electrochemical corrosion, Electronics industry, Oxides ArticleType: Technical paper View HTML | View PDF (2176 KB) | Reprints & Permissions

Book Review

Handbook of Thick Film Technology

Item No:	Item Information
1563187	Handbook of Thick Film Technology Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 Author(s): Keith Pitt View HTML

Materials for Engineers and Technicians

Item No:	Item Information
1563188	Materials for Engineers and Technicians Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 Author(s): Raymond A. Higgins View HTML

Industry news

SMART Group elects new Chairman

Item No:	Item Information
1563194	SMART Group elects new Chairman Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

A SMART fellow! awards

Item No:	Item Information
1563195	A SMART fellow! awards Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

RoHS assurance tests to support materials declarations

Item No:	Item Information
1563196	RoHS assurance tests to support materials declarations Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

ELFNET and COST 531 deliver lead-free solder alloy properties database

Item No:	Item Information
1563197	ELFNET and COST 531 deliver lead-free solder alloy properties database Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

phoenix|X-ray® enjoy a RECORD turnover record in 2005 year had a lot of highlights, prospects for 2006 are very positive

Item No:	Item Information
1563198	phoenix|X-ray® enjoy a RECORD turnover record in 2005 year had a lot of highlights, prospects for 2006 are very positive Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

JEDEC and IPC release tin whisker acceptance testing standard and mitigation practices guideline

Item No:	Item Information
1563199	JEDEC and IPC release tin whisker acceptance testing standard and mitigation practices guideline Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Affordable and highly accurate digital dispensing from OK International

Item No:	Item Information
1563200	Affordable and highly accurate digital dispensing from OK International Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Siemens Automation & Drives EA successful in 2006 “best factory” contest

Item No:	Item Information
1563201	Siemens Automation & Drives EA successful in 2006 “best factory” contest Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

How clean are your PCBs?

Item No:	Item Information
1563202	How clean are your PCBs? Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Commitment to customers and constant innovation earns DEK International the 2006 Frost & Sullivan award for market leadership

Item No:	Item Information
1563203	Commitment to customers and constant innovation earns DEK International the 2006 Frost & Sullivan award for market leadership Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

New hand-held convection tool delivers low cost precision SMT rework for lead-free processes

Item No:	Item Information
1563204	New hand-held convection tool delivers low cost precision SMT rework for lead-free processes Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Copley Motion Systems selects prism for precision

Item No:	Item Information
1563205	Copley Motion Systems selects prism for precision Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Components Bureau's Asian EMS deal provides the smart way to outsource manufacturing

Item No:	Item Information
1563206	Components Bureau's Asian EMS deal provides the smart way to outsource manufacturing Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Siemens acquires die bonder business from F&K Delvotec

Item No:	Item Information
1563207	Siemens acquires die bonder business from F&K Delvotec Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Local collaboration offers substantial benefit to aerospace and defence industries

Item No:	Item Information
1563208	Local collaboration offers substantial benefit to aerospace and defence industries Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Appointments

Norcott EMS appoints quality manager for accreditation drive

Item No:	Item Information
1563209	Norcott EMS appoints quality manager for accreditation drive Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Exhibitions and conferences

Printed Electronics Europe 2006, Churchill College, Cambridge, UK, 20 and 21 April 2006

Item No:	Item Information
1563210	Printed Electronics Europe 2006, Churchill College, Cambridge, UK, 20 and 21 April 2006 Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 Author(s): John Ling View HTML

NEPCON 2006, NEC, Birmingham, 9-11 May 2006

Item No:	Item Information
1563211	NEPCON 2006, NEC, Birmingham, 9-11 May 2006 Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 Author(s): John Ling View HTML

International diary

International diary

Item No:	Item Information
1563212	International diary Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1563213	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 3 View HTML