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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1581871	Laser soldering control using optical imaging James M. Gilbert, Zaif Dabestani (pp. 3-11) Keywords: Image processing, Lasers, Soldering, Solders ArticleType: Research paper View HTML | View PDF (469 KB) | Reprints & Permissions
1581872	Reliability of ACA bonded flip chip joints on LCP and PI substrates Laura Frisk, Anne Cumini (pp. 12-20) Keywords: Adhesives, Polymers, Reliability management, Substrates ArticleType: Research paper View HTML | View PDF (455 KB) | Reprints & Permissions
1581873	Failure analysis techniques for lead-free solder joints Todd Castello, Dan Rooney, Dongkai Shangguan (pp. 21-27) Keywords: Failure (mechanical), Joining materials, Lead, Solder ArticleType: Technical paper View HTML | View PDF (508 KB) | Reprints & Permissions
1581874	The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints Laura Frisk, Kati Kokko (pp. 28-37) Keywords: Adhesives, Joining materials, Reliability management, Substrates ArticleType: Research paper View HTML | View PDF (458 KB) | Reprints & Permissions
1581875	Determining conformal coating protection Christopher Hunt, Angela Mensah, Anthony Buxton, Richard Holman (pp. 38-47) Keywords: Coatings, Contamination, Corrosion protection, Fluxes ArticleType: Research paper View HTML | View PDF (549 KB) | Reprints & Permissions
1581876	The effect of reflow profile on SnPb and SnAgCu solder joint shear strength Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee (pp. 48-56) Keywords: Fracture, Shear strength, Soldering ArticleType: Research paper View HTML | View PDF (490 KB) | Reprints & Permissions

Emerald Literati Network

Awards for Excellence

Item No:	Item Information
1581877	Awards for Excellence Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Industry news

Universal Instruments and Tsinghua University sign co-operation agreement

Item No:	Item Information
1581878	Universal Instruments and Tsinghua University sign co-operation agreement Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Siemens acquires Opto-Control, a specialist for 3D automatic optical inspection systems

Item No:	Item Information
1581879	Siemens acquires Opto-Control, a specialist for 3D automatic optical inspection systems Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

SENSOR Conference 2007 Call for Papers

Item No:	Item Information
1581880	SENSOR Conference 2007 Call for Papers Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

SMT 2006 “best ever” exhibition for Hybrid Laser Tech

Item No:	Item Information
1581881	SMT 2006 “best ever” exhibition for Hybrid Laser Tech Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Universal Instruments leaves Dover portfolio

Item No:	Item Information
1581882	Universal Instruments leaves Dover portfolio Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

New products

New tools from DEK enable 25 micron backside wafer coating at high-speed

Item No:	Item Information
1581883	New tools from DEK enable 25 micron backside wafer coating at high-speed Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

OK International announces four new soldering/desoldering equipment packages

Item No:	Item Information
1581884	OK International announces four new soldering/desoldering equipment packages Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems

Item No:	Item Information
1581885	Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Showcasing JTAG ProVision™ at ESS

Item No:	Item Information
1581886	Showcasing JTAG ProVision™ at ESS Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

DEK develops solution for high throughput singulated substrate processing

Item No:	Item Information
1581887	DEK develops solution for high throughput singulated substrate processing Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

New clarity in adhesion from Opti-tec™ at Intertronics

Item No:	Item Information
1581888	New clarity in adhesion from Opti-tec™ at Intertronics Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

ATF wave soldering systems from Contax

Item No:	Item Information
1581889	ATF wave soldering systems from Contax Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Cordless, drip-free two pack dispenser makes it “light & easy”

Item No:	Item Information
1581890	Cordless, drip-free two pack dispenser makes it “light & easy” Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Universal Instruments enhances package-on-package flexibility

Item No:	Item Information
1581891	Universal Instruments enhances package-on-package flexibility Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Unrivalled customer support gets the green light with DEK's ISCAN health check

Item No:	Item Information
1581892	Unrivalled customer support gets the green light with DEK's ISCAN health check Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 View HTML

Book review

Electronic Circuits, Fundamentals and Applications, 3rd edition

Item No:	Item Information
1581893	Electronic Circuits, Fundamentals and Applications, 3rd edition Journal: Soldering & Surface Mount Technology Vol : 18 Issue: 4 Author(s): Brian Ellis View HTML