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Soldering & Surface Mount Technology


Volume 19 Issue 1

Published: 2007 | Start Page: 4

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Articles

Articles
Article No: Article Information:
1602748 Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls
J. Liang, N. Dariavach, P. Callahan, D. Shangguan (pp. 4-14)
Keywords: Circuits, Product reliability, Shear strength, Soldering
ArticleType: Research paper
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1602749 Optimization of lead free solder 01005 component assembly
Yueli Liu, R. Wayne Johnson (pp. 15-27)
Keywords: Assembly, Printed circuits, Resistors
ArticleType: Research paper
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1602750 Optimization of a reflow soldering process based on the heating factor
JinGang Gao, YiPing Wu, Han Ding (pp. 28-33)
Keywords: Optimization techniques, Regression analysis, Soldering
ArticleType: Research paper
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1602751 Process and pad design optimization for 01005 passive component surface mount assembly
Yu Wang, Michael Olorunyomi, Martin Dahlberg, Zoran Djurovic, Johan Anderson, Johan Liu (pp. 34-44)
Keywords: Electrical components, Printed circuits, Size reduction
ArticleType: Research paper
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Internet commentary

Internet commentary
Item No: Item Information
1602759 Internet commentary
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
Author(s): Brian Ellis
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Note from the publisher

Emerald at 40
Item No: Item Information
1602752 Emerald at 40
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
Author(s): Rebecca Marsh
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Industry news

RoHS PCB specification - what has to change?
Item No: Item Information
1602754 RoHS PCB specification - what has to change?
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
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SMT conference with renowned keynote speakers: Sino-European RoHS Dialogue on March 21, 2007
Item No: Item Information
1602755 SMT conference with renowned keynote speakers: Sino-European RoHS Dialogue on March 21, 2007
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
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EIPC Technology Seminar on Drilling and Routing of PCBs at Schmoll Maschinen GmbH in Germany
Item No: Item Information
1602756 EIPC Technology Seminar on Drilling and Routing of PCBs at Schmoll Maschinen GmbH in Germany
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
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Smart Group Special Seminar High Wycombe, November 7, 2006
Item No: Item Information
1602757 Smart Group Special Seminar High Wycombe, November 7, 2006
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
Author(s): J.H. Ling
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HumiSeal® celebrates 50 years as all chemistry conformal coatings vendor
Item No: Item Information
1602758 HumiSeal® celebrates 50 years as all chemistry conformal coatings vendor
Journal: Soldering & Surface Mount Technology
Vol : 19 Issue: 1
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