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Microelectronics International

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Articles

Articles

Article No:	Article Information:
1617130	Optimal process parameters design for a wire bonding of ultra-thin CSP package based on hybrid methods of artificial intelligence Yung-Hsiang Hung (pp. 3-10) Keywords: Artificial intelligence, Programming and algorithm theory, Surface mount technology ArticleType: Research paper View HTML | View PDF (310 KB) | Reprints & Permissions
1617131	Optimal wire sizing of buffered global interconnects Min Tang, J.F. Mao, L.L. Jiang (pp. 11-17) Keywords: Integrated circuits, Optimization techniques, Wires ArticleType: Research paper View HTML | View PDF (123 KB) | Reprints & Permissions
1617132	Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging Z.W. Zhong, T.Y. Tee, J-E. Luan (pp. 18-26) Keywords: Joining process, Soldering, Wires ArticleType: General review View HTML | View PDF (109 KB) | Reprints & Permissions
1617133	Studies on laser ablation of low temperature co-fired ceramics (LTCC) Winco K.C. Yung, Jijun Zhu (pp. 27-33) Keywords: Ceramics, Electronic equipment and components, MEMS ArticleType: Research paper View HTML | View PDF (348 KB) | Reprints & Permissions
1617134	A 3.5-GHz, low voltage, current draining folded mixer in 0.18-µm CMOS technology Harikrishnan Ramiah, Tun Zainal Azni Zulkifli (pp. 34-41) Keywords: Integrated circuits, Local area networks, Low voltage ArticleType: Technical paper View HTML | View PDF (325 KB) | Reprints & Permissions
1617135	Effect of line resistance and driver width on crosstalk in coupled VLSI interconnects Brajesh Kumar Kaushik, Sankar Sarkar, R.P. Agarwal, R.C. Joshi (pp. 42-45) Keywords: Circuit networks, Inductance ArticleType: Research paper View HTML | View PDF (195 KB) | Reprints & Permissions
1617136	Thermal modeling of semiconductor devices in power modules Kaiçar Ammous, Slim Abid, Anis Ammous (pp. 46-54) Keywords: Numerical analysis, Semiconductors, Simulation, Temperature ArticleType: Research paper View HTML | View PDF (334 KB) | Reprints & Permissions
1617137	Ku band response of Ag thick film microstripline to NixZn1-xFe2O4 overlay U.B. Lonkar, Vijaya Puri (pp. 55-59) Keywords: Films (states of matter), Microwave circuits ArticleType: Research paper View HTML | View PDF (136 KB) | Reprints & Permissions
1617138	Hot carrier injection in VDMOSFET for improvement of commutation process R. El Bitar, C. Salame, P. Mialhe (pp. 60-65) Keywords: Semiconductor devices, Switching circuits, Temperature ArticleType: Research paper View HTML | View PDF (306 KB) | Reprints & Permissions
1617139	Thermal and thermo-mechanical modelling of polymer overmoulded electronics Farhad Sarvar, David C. Whalley, David A. Hutt, Paul J. Palmer, Nee Joo Teh (pp. 66-75) Keywords: Electronics industry, Modelling, Polymers ArticleType: Research paper View HTML | View PDF (349 KB) | Reprints & Permissions

Industry news

Printed electronics – the sky is the limit

Item No:	Item Information
1617275	Printed electronics – the sky is the limit Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Elpida COO predicts DRAM shortage in second half of 2007

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1617276	Elpida COO predicts DRAM shortage in second half of 2007 Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Cadence speeds RF printed-circuit-board design cycle with new allegro PCB technology

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1617277	Cadence speeds RF printed-circuit-board design cycle with new allegro PCB technology Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

NPL SSTC lead-free meeting previews unique video of tin transformation

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1617278	NPL SSTC lead-free meeting previews unique video of tin transformation Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Wind River honoured as leader on the SD Times 100 list for fifth consecutive year

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1617279	Wind River honoured as leader on the SD Times 100 list for fifth consecutive year Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

A bright idea for Cranfield scientists

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1617280	A bright idea for Cranfield scientists Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Tests prove reliability of "chip-on-board" technology

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1617281	Tests prove reliability of "chip-on-board" technology Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

University of Glasgow James Watt Nanofabrication Centre officially opened

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1617282	University of Glasgow James Watt Nanofabrication Centre officially opened Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

ATEEDA joins Synopsys in-sync program

Item No:	Item Information
1617283	ATEEDA joins Synopsys in-sync program Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

M2FX plc achieves over $1 million (£600k) expansion funding to finance sales globally of its Miniflex Optical Fibre Solutions

Item No:	Item Information
1617284	M2FX plc achieves over $1 million (£600k) expansion funding to finance sales globally of its Miniflex Optical Fibre Solutions Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

New ASTM International Declarable Substances guide offers case studies to illustrate assessment process

Item No:	Item Information
1617285	New ASTM International Declarable Substances guide offers case studies to illustrate assessment process Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Appointments

iSLI appoints new chairman

Item No:	Item Information
1617286	iSLI appoints new chairman Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

International diary

International diary

Item No:	Item Information
1617287	International diary Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

New products

Cabot Microelectronics announces a major breakthrough in tungsten CMP technology with WIN™ CMP slurries

Item No:	Item Information
1617288	Cabot Microelectronics announces a major breakthrough in tungsten CMP technology with WIN™ CMP slurries Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

TSMC unveils Reference Flow 8.0 to address 45nm design challenges

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1617289	TSMC unveils Reference Flow 8.0 to address 45nm design challenges Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

The MathWorks introduces Simulink Design Verifier

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1617290	The MathWorks introduces Simulink Design Verifier Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

LSI Ships Industry's first 65nm iterative decoding read channels

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1617291	LSI Ships Industry's first 65nm iterative decoding read channels Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Avago Technologies launches next-generation millimetre-wave integrated circuit devices

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1617292	Avago Technologies launches next-generation millimetre-wave integrated circuit devices Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

LSI strengthens leadership in modem market with new line of embedded products

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1617293	LSI strengthens leadership in modem market with new line of embedded products Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

All Universal ZIF test sockets from Aries Electronics' now RoHS-compliant

Item No:	Item Information
1617294	All Universal ZIF test sockets from Aries Electronics' now RoHS-compliant Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Strategic Test releases ultrafast digital pattern generator PCI boards with up to 32GB on-board memory

Item No:	Item Information
1617295	Strategic Test releases ultrafast digital pattern generator PCI boards with up to 32GB on-board memory Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

New datasheet on RF Engines'HyperSpeed range of high-performance FFT cores now available

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1617296	New datasheet on RF Engines'HyperSpeed range of high-performance FFT cores now available Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

Tiny detector switch is reliable and versatile

Item No:	Item Information
1617297	Tiny detector switch is reliable and versatile Journal: Microelectronics International Vol : 24 Issue: 3 View HTML

The Future's bright and ferroelectric

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1617298	The Future's bright and ferroelectric Journal: Microelectronics International Vol : 24 Issue: 3 View HTML