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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1630606	Dissolution of copper on Sn-Ag-Cu system lead free solder Goro Izuta, Tsuyoshi Tanabe, Katsuaki Suganuma (pp. 4-11) Keywords: Circuit boards, Copper, Solder, Soldering ArticleType: Research paper View HTML | View PDF (373 KB) | Reprints & Permissions
1630607	Strain range fatigue life assessment of lead-free solder interconnects subject to temperature cycle loading Michael Osterman, Michael Pecht (pp. 12-17) Keywords: Fatigue, Modelling, Solder, Temperature measurement ArticleType: Research paper View HTML | View PDF (184 KB) | Reprints & Permissions
1630608	Global environmental impact assessment of the Pb-free shift Anders S.G. Andrae, Norihiro Itsubo, Atsushi Inaba (pp. 18-28) Keywords: Environmental management, Life cycle costs, Modelling, Solders ArticleType: Research paper View HTML | View PDF (197 KB) | Reprints & Permissions
1630609	High-cycle fatigue testing of Pb-free solder joints N. Barry, I.P. Jones, T. Hirst, I.M. Fox, J. Robins (pp. 29-38) Keywords: Fatigue, Solder, Vibration ArticleType: Research paper View HTML | View PDF (586 KB) | Reprints & Permissions

Editorial

Editorial

Item No:	Item Information
1630610	Editorial Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 Author(s): Martin Goosey View HTML

Industry news

Exception predicts big growth in “micro-miniature”

Item No:	Item Information
1630611	Exception predicts big growth in “micro-miniature” Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Growing demand for UK-based electromechanical sub-assembly confirmed by launch of new manufacturing group

Item No:	Item Information
1630612	Growing demand for UK-based electromechanical sub-assembly confirmed by launch of new manufacturing group Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Della Systems receives IPC Certification for Lead Free Electronics Assembly Process Capability

Item No:	Item Information
1630613	Della Systems receives IPC Certification for Lead Free Electronics Assembly Process Capability Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Assembléon wins Frost & Sullivan's 2006 Customer Value Enhancement Award

Item No:	Item Information
1630614	Assembléon wins Frost & Sullivan's 2006 Customer Value Enhancement Award Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Appointments

Exerra names Ian Fleck as General Manager

Item No:	Item Information
1630615	Exerra names Ian Fleck as General Manager Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

New products

Lightning Packaging announce launch of biodegradable and compostable air pillows

Item No:	Item Information
1630616	Lightning Packaging announce launch of biodegradable and compostable air pillows Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

New UV/visible adhesive technology provides aggressive bonds to PET and R-PET plastics

Item No:	Item Information
1630617	New UV/visible adhesive technology provides aggressive bonds to PET and R-PET plastics Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Valor announces vPlan – breakthrough in assembly process engineering

Item No:	Item Information
1630618	Valor announces vPlan – breakthrough in assembly process engineering Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

New Kit and Kaboodle from Intertronics

Item No:	Item Information
1630619	New Kit and Kaboodle from Intertronics Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Huntsman advanced materials introduces silver-filled epoxy die attach adhesive

Item No:	Item Information
1630620	Huntsman advanced materials introduces silver-filled epoxy die attach adhesive Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Award-winning Speedline dispensing from Contax

Item No:	Item Information
1630621	Award-winning Speedline dispensing from Contax Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Lead-free just got more economical

Item No:	Item Information
1630622	Lead-free just got more economical Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Universal extends flagship platform portfolio

Item No:	Item Information
1630623	Universal extends flagship platform portfolio Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Assembléon provides flexibility and performance with the A

Item No:	Item Information
1630624	Assembléon provides flexibility and performance with the A Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Assembléon's Installed Base Solutions provide value-added services to ensure lines stay competitive

Item No:	Item Information
1630625	Assembléon's Installed Base Solutions provide value-added services to ensure lines stay competitive Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

MYDATA introduces the Agilis Stick Magazine

Item No:	Item Information
1630626	MYDATA introduces the Agilis Stick Magazine Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML

Features

The Innovative Electronics Manufacturing Research Centre

Item No:	Item Information
1630627	The Innovative Electronics Manufacturing Research Centre Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 Author(s): Dr Darren Cadman View HTML

Unique resource puts region's electronics industry on the global map

Item No:	Item Information
1630628	Unique resource puts region's electronics industry on the global map Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 2 View HTML