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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1640678	Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag Mi Jin Kim, Y. (Norman) Zhou, Jae Pil Jung (pp. 3-8) Keywords: Bonding, Reliability management, Solder, Soldering ArticleType: Research paper View HTML | View PDF (243 KB) | Reprints & Permissions
1640679	The evolution of paste pressure during stencil printing David J. Clements, Marc P.Y. Desmulliez, Eitan Abraham (pp. 9-14) Keywords: Electronic equipment and components, Modelling, Pressure, Print media, Printed circuits ArticleType: Research paper View HTML | View PDF (190 KB) | Reprints & Permissions
1640680	Interfacial reactions between Sn-based solders and AgPt thick film metallizations on LTCC Olli Nousiainen, Tero Kangasvieri, Kari Rönkä, Risto Rautioaho, Jouko Vähäkangas (pp. 15-25) Keywords: Reliability management, Solders ArticleType: Research paper View HTML | View PDF (556 KB) | Reprints & Permissions
1640681	Multiphysics simulation of microwave curing in micro-electronics packaging applications T. Tilford, K.I. Sinclair, C. Bailey, M.P.Y. Desmulliez, G. Goussettis, A.K. Parrott, A.J. Sangster (pp. 26-33) Keywords: Electronic engineering, Microwaves, Polymers, Simulation ArticleType: Research paper View HTML | View PDF (551 KB) | Reprints & Permissions

Industry news

IONMET – new ionic liquid solvent technology to transform metal finishing

Item No:	Item Information
1640733	IONMET – new ionic liquid solvent technology to transform metal finishing Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 Author(s): Pete Starkey View HTML

RoHS reliability – success or failure?

Item No:	Item Information
1640734	RoHS reliability – success or failure? Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

Advanced directory solves the problems of solder stencil efficiency

Item No:	Item Information
1640735	Advanced directory solves the problems of solder stencil efficiency Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

Assembléon partners with HIN to strengthen sales and service in Denmark

Item No:	Item Information
1640736	Assembléon partners with HIN to strengthen sales and service in Denmark Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

Exhibitions and conferences

NEPCON 2007 National Exhibition Centre, Birmingham, 14-16 May 2007

Item No:	Item Information
1640737	NEPCON 2007 National Exhibition Centre, Birmingham, 14-16 May 2007 Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 Author(s): J. H. Ling View HTML

EIPC/IPC Executive Market and Technology Forum Conference, Copenhagen, 11 and 12 October 2007

Item No:	Item Information
1640738	EIPC/IPC Executive Market and Technology Forum Conference, Copenhagen, 11 and 12 October 2007 Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 Author(s): Martin Goosey View HTML

New products

Siplace D2 and D1: new Siemens placement machines for electronics manufacturers with medium-sized volumes and the highest quality requirements

Item No:	Item Information
1640739	Siplace D2 and D1: new Siemens placement machines for electronics manufacturers with medium-sized volumes and the highest quality requirements Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

New valves from Intertronics dispense micro-dots in all viscosities

Item No:	Item Information
1640740	New valves from Intertronics dispense micro-dots in all viscosities Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

BPM Microsystems display the next generation of the Helix Automated Device Programmer at Nepcon UK 2007

Item No:	Item Information
1640741	BPM Microsystems display the next generation of the Helix Automated Device Programmer at Nepcon UK 2007 Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

RMD Instruments LeadTracer- RoHS XRF shown at Nepcon UK

Item No:	Item Information
1640742	RMD Instruments LeadTracer- RoHS XRF shown at Nepcon UK Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

Siplace Maintenance Manager: The right maintenance at the right time – for any line component

Item No:	Item Information
1640743	Siplace Maintenance Manager: The right maintenance at the right time – for any line component Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

Assembléon's latest A-Series pick and place machine handles a very wide component range with 20 micron accuracy

Item No:	Item Information
1640744	Assembléon's latest A-Series pick and place machine handles a very wide component range with 20 micron accuracy Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML

Portable, localised fume extractor for improved productivity

Item No:	Item Information
1640745	Portable, localised fume extractor for improved productivity Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 3 View HTML