Search

Search:(Access key 2)

• Athens/Institution Login |
• Register |
• Forgot Password?

Home >  Browse > Journal Issue List

E-mail this page

Soldering & Surface Mount Technology

---

Articles

Articles

Article No:	Article Information:
1640771	Assembly issues with Sn/Ag/Cu bumped flip chips Sunil Gopakumar, Peter Borgesen, K. Srihari (pp. 3-10) Keywords: Assembly, Flipchips, Soldering, Yield ArticleType: Research paper View HTML | View PDF (376 KB) | Reprints & Permissions
1640808	Hydrocarbon fluxes for ionic compound free soldering Toshihiro Miyake, Masaru Ishida, Satoshi Inagaki (pp. 11-17) Keywords: Fluxes, Soldering ArticleType: Research paper View HTML | View PDF (242 KB) | Reprints & Permissions
1640773	Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate Z.W. Zhong, P. Arulvanan, Hla Phone Maw, C.W.A. Lu (pp. 18-24) Keywords: Joining materials, Solders, Substrates ArticleType: Research paper View HTML | View PDF (228 KB) | Reprints & Permissions
1640774	Low cycle isothermal fatigue properties of lead-free solders Miloš Dušek, Christopher Hunt (pp. 25-32) Keywords: Fatigue, Solders ArticleType: Research paper View HTML | View PDF (429 KB) | Reprints & Permissions

Industry news

A-Series Assembléon Manufacturing Suite (AMS) optimises SMT production line performance

Item No:	Item Information
1640775	A-Series Assembléon Manufacturing Suite (AMS) optimises SMT production line performance Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Selective soldering system from Contax meets Jaltek's requirements

Item No:	Item Information
1640776	Selective soldering system from Contax meets Jaltek's requirements Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Siemens honoured with Delphi Corporation's Pinnacle Award

Item No:	Item Information
1640777	Siemens honoured with Delphi Corporation's Pinnacle Award Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Contax sells first FX-D after Nepcon launch for medical device production

Item No:	Item Information
1640778	Contax sells first FX-D after Nepcon launch for medical device production Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Online auction offers new alternative

Item No:	Item Information
1640779	Online auction offers new alternative Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

RFTRAQ purchases Contax equipment to manufacture active RFID hardware

Item No:	Item Information
1640780	RFTRAQ purchases Contax equipment to manufacture active RFID hardware Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Military certification for HumiSeal's UV40 range

Item No:	Item Information
1640781	Military certification for HumiSeal's UV40 range Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

DEK's packaging innovations land two industry honours

Item No:	Item Information
1640782	DEK's packaging innovations land two industry honours Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

NBS Design expands its PCB layout business nationally

Item No:	Item Information
1640783	NBS Design expands its PCB layout business nationally Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

New appointments

Exerra appoints Don Beard Engineering Manager for North America

Item No:	Item Information
1640784	Exerra appoints Don Beard Engineering Manager for North America Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

New products

OK International launches new APR-5000-DZ array package rework system with dual convection bottom-side heating for lead-free rework and high-thermal demand applications

Item No:	Item Information
1640785	OK International launches new APR-5000-DZ array package rework system with dual convection bottom-side heating for lead-free rework and high-thermal demand applications Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Lord Corporation announces advancements in flip chip underfill technology for lead-free component packaging

Item No:	Item Information
1640786	Lord Corporation announces advancements in flip chip underfill technology for lead-free component packaging Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Grove fuel cell symposium showcased DEK's enhanced fuel cell expertise

Item No:	Item Information
1640787	Grove fuel cell symposium showcased DEK's enhanced fuel cell expertise Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

“Adhere” diaphragm valve dispenses UV adhesives

Item No:	Item Information
1640788	“Adhere” diaphragm valve dispenses UV adhesives Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML

Arka Technologies launches revolutionary Smartshield™ EMI shielding product

Item No:	Item Information
1640789	Arka Technologies launches revolutionary Smartshield™ EMI shielding product Journal: Soldering & Surface Mount Technology Vol : 19 Issue: 4 View HTML