Emerald Login
   

Welcome guest



Microelectronics International
Browse
User Guides
Online Access
Journal Information

Microelectronics International


Volume 25 Issue 1

Published: 2008 | Start Page: 3

Icon Key:   Icon: Requires login or subscription. Requires login or subscription   Icon: Backfiles. Backfiles   Icon: EarlyCite. EarlyCite

Articles

Articles
Article No: Article Information:
1642144 Low-power wireless smart data acquisition system for monitoring pressure in medical application
K. Arshak, A. Arshak, E. Jafer, D. Waldern, J. Harris (pp. 3-14)
Keywords: Electric medical equipment, Sensors, Wireless
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (398 KB) | Reprints & Permissions
1642086 Electromagnetic band-gap (EBG) structures using combined inductive and capacitive elements and chirping-and-tapering technique
Ming-Sze Tong, Tae-Gyu Chang, Ronan Sauleau (pp. 15-20)
Keywords: Electromagnetic fields, Electromagnetic induction
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (279 KB) | Reprints & Permissions
1642087 Silicon MOSFET devices electrical parameters evolution at high temperatures
C. Salame, R. Habchi (pp. 21-24)
Keywords: Electronic equipment and components, Numerical analysis, Temperature
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (87 KB) | Reprints & Permissions
1642088 Thick and thin film microstripline properties due to polyaniline thin film overlay
B.B. Vhanakhande, S.V. Jadhav, Vijaya Puri (pp. 25-29)
Keywords: Electromagnetic induction, Microwaves, Thin films
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (163 KB) | Reprints & Permissions
1642089 Edge direct tunneling current in nano-scale MOSFET with high-K dielectrics
Jian-hong Yang, Gui-fang Li, Hui-lan Liu (pp. 30-33)
Keywords: Dielectric properties, Electric currents
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (183 KB) | Reprints & Permissions
1642090 Wire bond challenges in low-k devices
Srikanth Narasimalu (pp. 34-40)
Keywords: Dielectric properties, Welding
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (539 KB) | Reprints & Permissions
1642091 Effects of scaling on the impact ionization and sub-threshold current in submicron MOSFETs
Bhavana Jharia, S. Sarkar, R.P. Agarwal (pp. 41-45)
Keywords: Electric current, Electric fields
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (102 KB) | Reprints & Permissions
1642092 XPS and AFM investigations on silver-based photoimageable thick film systems
Govind Umarji, Supriya Ketkar, Ranjit Hawaldar, Suresh Gosavi, Kashinath Patil, Uttam Mulik, Dinesh Amalnerkar (pp. 46-57)
Keywords: Microscopy, Silver, Thick film circuits, X-rays
ArticleType: Research paper
Icon: Requires login or subscription. View HTML | View PDF (1075 KB) | Reprints & Permissions

Industry news

The new challenge of M2M:putting the pieces together for total information convergence
Item No: Item Information
1642243 The new challenge of M2M:putting the pieces together for total information convergence
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Agreement between Laird Technologies and ITEQ Corporation provides unique solution for flat panel display market
Item No: Item Information
1642244 Agreement between Laird Technologies and ITEQ Corporation provides unique solution for flat panel display market
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
IPC market research studies on strategies for global expansion and microelectronics
Item No: Item Information
1642245 IPC market research studies on strategies for global expansion and microelectronics
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Surrey Nanosystems wins order for advanced sputtering tool from poland's Institute of Electron Technology
Item No: Item Information
1642246 Surrey Nanosystems wins order for advanced sputtering tool from poland's Institute of Electron Technology
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
ASTM declarable substances subcommittee developing proposed tin-based solder alloys standard
Item No: Item Information
1642247 ASTM declarable substances subcommittee developing proposed tin-based solder alloys standard
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML

New appointments

New appointments at the Edinburgh International Science Festival
Item No: Item Information
1642248 New appointments at the Edinburgh International Science Festival
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Emerald ex-editor honoured by UN and USA
Item No: Item Information
1642249 Emerald ex-editor honoured by UN and USA
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML

International diary

International diary
Item No: Item Information
1642250 International diary
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML

New products

Pickering Interfaces introduces new LXI optical switching solution
Item No: Item Information
1642251 Pickering Interfaces introduces new LXI optical switching solution
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
QuickLogic adds a high-speed SPI Host Controller option into its CSSP library
Item No: Item Information
1642252 QuickLogic adds a high-speed SPI Host Controller option into its CSSP library
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
New range of linked LEDs
Item No: Item Information
1642253 New range of linked LEDs
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Avago Technologies introduces ultra-compact input device with multi-mode linear and 2D navigation for handheld, and ultra-miniature PC applications
Item No: Item Information
1642254 Avago Technologies introduces ultra-compact input device with multi-mode linear and 2D navigation for handheld, and ultra-miniature PC applications
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
HUBER +SUHNER launches SC-RJ IP67 Fibre Optic assemblies for harsh environments
Item No: Item Information
1642255 HUBER +SUHNER launches SC-RJ IP67 Fibre Optic assemblies for harsh environments
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
LSI APP3300 advanced communication processor offers new levels of real-time service delivery for next-generation access networks
Item No: Item Information
1642256 LSI APP3300 advanced communication processor offers new levels of real-time service delivery for next-generation access networks
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
New RoHS-compliant programmable headers and covers by Aries Electronics eliminate the need for DIP switches
Item No: Item Information
1642257 New RoHS-compliant programmable headers and covers by Aries Electronics eliminate the need for DIP switches
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Custom gold and silver plating for high-performance waveguides
Item No: Item Information
1642258 Custom gold and silver plating for high-performance waveguides
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Software upgrade from Zensys
Item No: Item Information
1642259 Software upgrade from Zensys
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Fairchild Semiconductor's IntelliMAX series in space-efficient, 2 x 2mm green MLP package provides 45 per cent improved thermal dissipation in portables
Item No: Item Information
1642260 Fairchild Semiconductor's IntelliMAX series in space-efficient, 2 x 2mm green MLP package provides 45 per cent improved thermal dissipation in portables
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Adapt, adopt, improve Thinky at Deutsch
Item No: Item Information
1642261 Adapt, adopt, improve Thinky at Deutsch
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Miniature Rogowski probes upgraded for power electronics market
Item No: Item Information
1642262 Miniature Rogowski probes upgraded for power electronics market
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
SAW components: smallest duplexer for WCDMA Band VIII
Item No: Item Information
1642263 SAW components: smallest duplexer for WCDMA Band VIII
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML
Rugged LCD touch screens for embedded applications
Item No: Item Information
1642264 Rugged LCD touch screens for embedded applications
Journal: Microelectronics International
Vol : 25 Issue: 1
Icon: Requires login or subscription View HTML