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Microelectronics International

Volume 12 Issue 1

Published: 1995 | Start Page: 2

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Articles

Articles
Article No: Article Information:
1666919 Microelectronics International
Karel Kurzweil (pp. 2-3)
Keywords:
ArticleType: General review
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1666920 A Physics-of-failure Design Philosophy Applied to Flip-chip Bonds
C. Pusarla, A. Dasgupta, M.G. Pecht, A. Christou (pp. 6-12)
Keywords:
ArticleType: General review
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1666921 Thick Film Technology Applied to Chemical Sensors
F. Ménil, C. Lucat, H. Debéda (pp. 13-18)
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ArticleType: General review
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1666922 Photoimageable Thick Films for Multichip Modules
M. Vrana, A. Van Calster, D. Vanicky, W. Delbare, R. Vanden Berghe, S. Demolder, K. Allaert (pp. 16-18)
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ArticleType: General review
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1666923 Interferometric Micropositioning in the Planar Chip Insertion Technique for Multichip Modules (MCMs)
A. Vareille, A. Schiltz, P. Ballet, J.C. Hauüy, L. Thévenot (pp. 19-21)
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ArticleType: General review
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1666924 Resist Coating of Cylindrical Samples for 3-D Lithography
C.G. Giaconia, G. Grasso, C. Arnone (pp. 22-24)
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ArticleType: General review
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1666925 The Characterisation of High Frequency Planar Thick-film Transformers
A.R. Cornwell (pp. 25-26)
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ArticleType: General review
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1666926 A Survey of Techniques for Producing Known Good Die
K. Ball (pp. 27-30)
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ArticleType: General review
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