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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1718867	An investigation into the rheological properties of different lead-free solder pastes for surface mount applications S. Mallik, N.N. Ekere, R. Durairaj, A.E. Marks (pp. 3-10) Keywords: Creep, Lead, Rheological properties, Slip, Solder paste ArticleType: Research paper View HTML | View PDF (204 KB) | Reprints & Permissions
1718868	Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg) John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan (pp. 11-20) Keywords: Density, Lead, Low temperatures, Packaging processes, Solder ArticleType: Research paper View HTML | View PDF (466 KB) | Reprints & Permissions
1718869	Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg) John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan (pp. 21-29) Keywords: Density, Lead, Low temperatures, Packaging processes, Solder ArticleType: Research paper View HTML | View PDF (280 KB) | Reprints & Permissions
1718870	Reliability study of surface mount printed circuit board assemblies with lead-free solder joints Jeffery C.C. Lo, B.F. Jia, Z. Liu, J. Zhu, S.W. Ricky Lee (pp. 30-38) Keywords: Lead, Packaging, Printed circuits, Shear strength, Solder, Thermal measurement ArticleType: Technical paper View HTML | View PDF (559 KB) | Reprints & Permissions

Industry news

A technology road map for the PCB industry

Item No:	Item Information
1718871	A technology road map for the PCB industry Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Successful campaign for BSI committee members

Item No:	Item Information
1718872	Successful campaign for BSI committee members Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

IPC releases Revision B of IPC-7711/7721

Item No:	Item Information
1718873	IPC releases Revision B of IPC-7711/7721 Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

OK International announces European price reductions

Item No:	Item Information
1718874	OK International announces European price reductions Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Siplace future proofs TTems UK growth

Item No:	Item Information
1718875	Siplace future proofs TTems UK growth Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Marantz UK user group meeting puts new AOI software through its paces

Item No:	Item Information
1718876	Marantz UK user group meeting puts new AOI software through its paces Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Conductive Inkjet Technology to install first Metaljet 6000 system and offer a contract manufacturing service from Cambridge UK

Item No:	Item Information
1718877	Conductive Inkjet Technology to install first Metaljet 6000 system and offer a contract manufacturing service from Cambridge UK Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Appointments

Kent Ang to lead DEK's electroform and platinum stencil production in Asia

Item No:	Item Information
1718878	Kent Ang to lead DEK's electroform and platinum stencil production in Asia Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

David Byrd appointed Global Manager for Engineered Products

Item No:	Item Information
1718879	David Byrd appointed Global Manager for Engineered Products Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Exerra appoints four North American reps

Item No:	Item Information
1718880	Exerra appoints four North American reps Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

Exhibition and conferences

EIPC Conference Rome 24 and 25 January 2008

Item No:	Item Information
1718881	EIPC Conference Rome 24 and 25 January 2008 Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 Author(s): John Ling View HTML

International diary

International diary

Item No:	Item Information
1718882	International diary Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML

New products

Automated Bonded Wafer Inspection Tool from Sonoscan

Item No:	Item Information
1718883	Automated Bonded Wafer Inspection Tool from Sonoscan Journal: Soldering & Surface Mount Technology Vol : 20 Issue: 2 View HTML