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Microelectronics International

Volume 25 Issue 3

Published: 2008 | Start Page: 3

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Articles

Articles
Article No:	Article Information:
1737974	Creation and verification of dynamic compact thermal model of a BGA package F. Mohammadi, M. Marami (pp. 3-13) Keywords: Electronic engineering, Electronic equipment and components, Modelling, Simulation, Thermal measurement ArticleType: Research paper View HTML \| View PDF (631 KB) \| Reprints & Permissions
1737975	Application of the back-gate bias in MOSFET for a switch-type comparator in 4-b flash A/D converter Zhi-Yuan Cui, Yeong-Seuk Kim, Moon-Ho Choi, Hyung-Gyoo Lee, Nam-Soo Kim (pp. 14-18) Keywords: Comparator circuits, Electric current, Electronic engineering, Ignition voltage ArticleType: Research paper View HTML \| View PDF (234 KB) \| Reprints & Permissions
1737976	Wire bonding of low-k devices Z.W. Zhong (pp. 19-25) Keywords: Bonding, Dielectric strength, Wires ArticleType: Literature review View HTML \| View PDF (97 KB) \| Reprints & Permissions
1737977	A voltage reference circuit for current source of RFIC blocks A. Marzuki, Zaliman Sauli, Ali Yeon Md Shakaff (pp. 26-32) Keywords: Electric current, Oscillators, Radio frequencies, Semiconductor devices, Temperature, Voltage ArticleType: Research paper View HTML \| View PDF (434 KB) \| Reprints & Permissions
1737978	Studies on temperature coefficient of resistance (TCR) of polymer thick film resistors Y. Srinivasa Rao (pp. 33-36) Keywords: Films (states of matter), High voltage, Polymers, Resistors, Temperature coefficient of resistance ArticleType: Research paper View HTML \| View PDF (72 KB) \| Reprints & Permissions
1737979	Prediction of microwave permittivity of leafy vegetation using Ag thick film microstripline P.D. Kamble, Vijaya Puri (pp. 37-40) Keywords: Dielectric devices, Dielectric strength, Films (state of matter), Microwaves, Moisture measurement, Plants ArticleType: Research paper View HTML \| View PDF (87 KB) \| Reprints & Permissions
1737980	Photoconductive cells from screen-printed and sintered cadmium sulfoselenide Jirí Franc, Stanislav Nešpurek (pp. 41-46) Keywords: Detectors (circuits), Pastes, Photoconductivity, Sintering ArticleType: Research paper View HTML \| View PDF (219 KB) \| Reprints & Permissions

Industry news

All you ever wanted to know about gate dielectrics but…
Item No:	Item Information
1737981	All you ever wanted to know about gate dielectrics but… Journal: Microelectronics International Vol : 25 Issue: 3 Author(s): John Wolstenholme View HTML

Rohm and Haas announces agreement to develop implant solutions with IBM
Item No:	Item Information
1737982	Rohm and Haas announces agreement to develop implant solutions with IBM Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Intel, Samsung Electronics, TSMC reach agreement for 450 mm wafer manufacturing transition
Item No:	Item Information
1737983	Intel, Samsung Electronics, TSMC reach agreement for 450 mm wafer manufacturing transition Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Rohm and Haas Company acquires Gracel Display
Item No:	Item Information
1737984	Rohm and Haas Company acquires Gracel Display Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

ASML Ships 1,000th KrF lithography system; milestone confirms KrF leadership in productivity and system extendibility
Item No:	Item Information
1737985	ASML Ships 1,000th KrF lithography system; milestone confirms KrF leadership in productivity and system extendibility Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Digitaltest and Fast Electronic Technology Ltd sign agreement for China, Taiwan, and Hongkong
Item No:	Item Information
1737986	Digitaltest and Fast Electronic Technology Ltd sign agreement for China, Taiwan, and Hongkong Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Micro-components for high-volume needs
Item No:	Item Information
1737987	Micro-components for high-volume needs Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

iSLI to accept Mentor Graphics tokens for CPD courses
Item No:	Item Information
1737988	iSLI to accept Mentor Graphics tokens for CPD courses Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Quicklogic and Sital announce development partnership for MIL-STD-1553 CORE
Item No:	Item Information
1737989	Quicklogic and Sital announce development partnership for MIL-STD-1553 CORE Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

It is RFID but not as we know it
Item No:	Item Information
1737990	It is RFID but not as we know it Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

ACW Technology selects phoenix / X-ray from Contax
Item No:	Item Information
1737991	ACW Technology selects phoenix / X-ray from Contax Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

LSI joins open NAND Flash Interface Working Group
Item No:	Item Information
1737992	LSI joins open NAND Flash Interface Working Group Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Technological Innovation in the South West of England continues to thrive
Item No:	Item Information
1737993	Technological Innovation in the South West of England continues to thrive Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Xintronix leads the way to faster links
Item No:	Item Information
1737994	Xintronix leads the way to faster links Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Thermal simulation tool reduces IC cost by comparing flip-chip/wire bond thermal performance
Item No:	Item Information
1737995	Thermal simulation tool reduces IC cost by comparing flip-chip/wire bond thermal performance Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Synopsys HSIM-XA adopted by STMicroelectronics for its advanced Smart Power technology
Item No:	Item Information
1737996	Synopsys HSIM-XA adopted by STMicroelectronics for its advanced Smart Power technology Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Appointments

iSLI Appoints New Members to the Design Team
Item No:	Item Information
1737997	iSLI Appoints New Members to the Design Team Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Air Semiconductor appoints new CEO
Item No:	Item Information
1737998	Air Semiconductor appoints new CEO Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

iSLI Appoints New Technology Group Director
Item No:	Item Information
1737999	iSLI Appoints New Technology Group Director Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

International diary

International diary
Item No:	Item Information
1738000	International diary Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Exhibitions and conferences

MicroTech 2008 Beaumont House, Old Windsor June 10 and 11 2008
Item No:	Item Information
1738001	MicroTech 2008 Beaumont House, Old Windsor June 10 and 11 2008 Journal: Microelectronics International Vol : 25 Issue: 3 Author(s): John Ling View HTML

New products

ThermPaq from Flomerics accelerates thermal characterisation of semiconductor packages
Item No:	Item Information
1738002	ThermPaq from Flomerics accelerates thermal characterisation of semiconductor packages Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Habia Cable launches new wires and cables for explosive environments
Item No:	Item Information
1738003	Habia Cable launches new wires and cables for explosive environments Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Thermo Fisher Scientific’s New Nicolet iS10 FT-IR spectrometer simplifies infrared spectroscopy for QA/QC and investigative analytical laboratories
Item No:	Item Information
1738004	Thermo Fisher Scientific’s New Nicolet iS10 FT-IR spectrometer simplifies infrared spectroscopy for QA/QC and investigative analytical laboratories Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Fairchild Semiconductor launches SPM® Products for driving two-phase switched reluctance motors
Item No:	Item Information
1738005	Fairchild Semiconductor launches SPM® Products for driving two-phase switched reluctance motors Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Synopsys and TSMC collaborate on advanced HSPICE modelling technology for 40 nm processes
Item No:	Item Information
1738006	Synopsys and TSMC collaborate on advanced HSPICE modelling technology for 40 nm processes Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Visual Enhancement Engine (VEE) evaluation module provides an easy way to “seeing is believing”
Item No:	Item Information
1738007	Visual Enhancement Engine (VEE) evaluation module provides an easy way to “seeing is believing” Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

Precision Impedance Analysers fast and accurate with intuitive interface
Item No:	Item Information
1738008	Precision Impedance Analysers fast and accurate with intuitive interface Journal: Microelectronics International Vol : 25 Issue: 3 View HTML

TSMC first to deliver 40 nm process technology
Item No:	Item Information
1738009	TSMC first to deliver 40 nm process technology Journal: Microelectronics International Vol : 25 Issue: 3 View HTML