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Failure analysis of electronic components and interconnection systems

Article Information:

Title:

Failure analysis of electronic components and interconnection systems

Author(s):

C.A. Smith

Journal:

Circuit World

Year:

2007

Volume:

33

Issue:

1

Page:

15 - 21


ISSN:

0305-6120


DOI:

10.1108/03056120710723670

Publisher:

Emerald Group Publishing Limited

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Abstract:

Purpose – The failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed.

Design/methodology/approach – How the analytical techniques used for physical and chemical analysis, which include X-ray radiography, optical microscopy and scanning electron microscopy/energy dispersive X-ray spectroscopy, are used.

Findings – Examples from recent case studies are given to illustrate the work.

Originality/value – The paper demonstrates how the failure analysis of an electronic component or interconnection system is conducted, and what can be learnt from the investigation.

Keywords:

Electronic equipment and components, Radiography, Reliability management


Article Type:

Technical paper


Article URL:

http://www.emeraldinsight.com/10.1108/03056120710723670

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