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Article Information:
Title:
Failure analysis of electronic components and interconnection systems
Author(s):
C.A. Smith
Journal:
Year:
2007
Volume:
Issue:
Page:
15 - 21
DOI:
10.1108/03056120710723670
Publisher:
Emerald Group Publishing Limited
Document Access:
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(595 KB)
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Abstract:
Purpose – The failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed.
Design/methodology/approach – How the analytical techniques used for physical and chemical analysis, which include X-ray radiography, optical microscopy and scanning electron microscopy/energy dispersive X-ray spectroscopy, are used.
Findings – Examples from recent case studies are given to illustrate the work.
Originality/value – The paper demonstrates how the failure analysis of an electronic component or interconnection system is conducted, and what can be learnt from the investigation.
Keywords:
Electronic equipment and components,
Radiography,
Reliability management
Article Type:
Technical paper
References:
Article URL:
www.emeraldinsight.com/10.1108/03056120710723670