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Wire bonding using copper wire

Article Information:

Title:

Wire bonding using copper wire

Author(s):

Z.W. Zhong

Journal:

Microelectronics International

Year:

2009

Volume:

26

Issue:

1

Page:

10 - 16


ISSN:

1356-5362


DOI:

10.1108/13565360910923115

Publisher:

Emerald Group Publishing Limited

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Abstract:

Purpose – This paper attempts to review recent advances in wire bonding using copper wire.

Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed.

Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strain-hardening effects, and stiff wire on weak support structures are briefly analysed. The solutions to the problems and recent findings/developments in wire bonding using copper wire are discussed.

Research limitations/implications – Because of page limitation of the paper, only a brief review is conducted. Further reading is needed for more details.

Originality/value – This paper attempts to provide introduction to recent developments and the trends in wire bonding using copper wire. With the references provided, readers may explore more deeply by reading the original articles.

Keywords:

Copper, Joining processes, Wires


Article Type:

General review


Article URL:

http://www.emeraldinsight.com/10.1108/13565360910923115

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