To read this content please select one of the options below:

Six sigma analysis of SMD feeding parameters and board assembly quality

Pekka Kytösaho (Nokia Corporation, Salo, Finland)
Timo Liukkonen (Nokia Corporation, Salo, Finland)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 26 June 2009

1832

Abstract

Purpose

Little interest has been shown in pickup conditions and parameters and their effect on placement accuracy in the literature before. The purpose of this paper is to find out the possible link between pickup conditions and placement accuracy of typical discrete chip components.

Design/methodology/approach

A dedicated test board was developed and used to study the ultimate critical pickup conditions. Then the same board was used to find out the best parameters between ultimate conditions and perfect conditions in order to define working limits for good enough pickup that would work well in practice.

Findings

The link between pickup conditions and placement quality was found and converted into measurable controllable values. Additionally, a problem was surprisingly detected in the placement machine's vision performance resulting in inaccuracy, and parameters were re‐defined to avoid this problem in real‐world production. Based on all the findings, the best parameters were defined for component pickup.

Originality/value

This paper discusses the effect of component pickup conditions on accuracy which is seldom handled in the literature. Owing to smaller spacing between chip components in the future, pickup is becoming more important; components will simply have to be picked up more and more on the centre to avoid collision with components already been placed. This paper clearly shows the requirement for placement machine manufacturers to develop more accurate pickup tools for the future.

Keywords

Citation

Kytösaho, P. and Liukkonen, T. (2009), "Six sigma analysis of SMD feeding parameters and board assembly quality", Soldering & Surface Mount Technology, Vol. 21 No. 3, pp. 39-46. https://doi.org/10.1108/09540910910970402

Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited

Related articles