Wire bonding of low‐k devices

The purpose of this paper is to review recent advances in wire bonding of low‐k devices.

Dozens of journal and conference articles published in 2005‐2008 are reviewed.

The paper finds that many articles have discussed and analysed problems/challenges such as bond pad metal peeling/lift, non‐sticking on pad, decreased bonding strength and lower wire‐bond assembly yield. The paper discusses the articles' solutions to the problems and recent findings/developments in wire bonding of low‐k devices.

Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.

The paper attempts to provide an introduction to recent developments and the trends in wire bonding of low‐k devices. With the references provided, readers may explore more deeply by reading the original articles.