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Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Yuanming Chen (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China AND Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Shouxu Wang (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Xuemei He (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Wei He (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China AND Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou, China)
Vadim V. Silberschmidt (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, United Kingdom)
Ze Tan (Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou, China)

Circuit World

ISSN: 0305-6120

Article publication date: 5 May 2015

2358

Abstract

Purpose

The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation.

Design/methodology/approach

Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB.

Findings

The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing.

Originality/value

The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (no. 201301C0105324342), National Natural Science Foundation of China (no. 61474019) and also express their sincere thanks to the support of the China Scholarship Council (no. 201306070032).

Citation

Chen, Y., Wang, S., He , X., He, W., Silberschmidt, V.V. and Tan, Z. (2015), "Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability", Circuit World, Vol. 41 No. 2, pp. 55-60. https://doi.org/10.1108/CW-11-2014-0052

Publisher

:

Emerald Group Publishing Limited

Copyright © 2015, Emerald Group Publishing Limited

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