Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method
Abstract
Purpose
This paper aims to use the Laplace Adomian decomposition method (LADM) to investigate the effects of thermal convection, thermal conduction, surface emissivity and thermal radiation on the heat dissipated by a continuously moving plate undergoing thermal processing.
Design/methodology/approach
In performing the analysis, it is assumed that the thermal conductivity and surface emissivity of the plate are both temperature-dependent. The accuracy of the LADM solutions is confirmed by comparing the results obtained for the temperature distribution within the plate with those reported in the literature based on the differential transformation method.
Findings
It is shown that the heat dissipated from the plate reduces as the Peclet number increases. By contrast, the dissipated heat increases as any one of the non-dimensionalized parameters of the system, i.e. Nc, Nr and B, increases. In addition, the temperature drop along the length of the plate reduces as parameter A increases owing to a more rapid heat transfer.
Originality/value
The results provide a useful source of reference for the choice of suitable materials and cooling fluids in a variety of practical applications.
Keywords
Acknowledgements
The authors gratefully acknowledge the financial support provided to this study by the Ministry of Science and Technology of Taiwan under grant number MOST 105-2221-E-018-019.
Citation
Chen, C.K., Chang, Y.-S., Liu, C.-C. and Chen, B.-S. (2017), "Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method", Engineering Computations, Vol. 34 No. 7, pp. 2242-2255. https://doi.org/10.1108/EC-04-2017-0150
Publisher
:Emerald Publishing Limited
Copyright © 2017, Emerald Publishing Limited