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Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method

Cha’o Kuang Chen (Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan)
Yu-Shen Chang (Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan)
Chin-Chia Liu (Department of Industrial Education and Technology, National Changhua University of Education, Changhua, Taiwan)
Bang-Shiuh Chen (School of Aeronautics and Astronautics, Purdue University, West Lafayette, Indiana, USA)

Engineering Computations

ISSN: 0264-4401

Article publication date: 2 October 2017

105

Abstract

Purpose

This paper aims to use the Laplace Adomian decomposition method (LADM) to investigate the effects of thermal convection, thermal conduction, surface emissivity and thermal radiation on the heat dissipated by a continuously moving plate undergoing thermal processing.

Design/methodology/approach

In performing the analysis, it is assumed that the thermal conductivity and surface emissivity of the plate are both temperature-dependent. The accuracy of the LADM solutions is confirmed by comparing the results obtained for the temperature distribution within the plate with those reported in the literature based on the differential transformation method.

Findings

It is shown that the heat dissipated from the plate reduces as the Peclet number increases. By contrast, the dissipated heat increases as any one of the non-dimensionalized parameters of the system, i.e. Nc, Nr and B, increases. In addition, the temperature drop along the length of the plate reduces as parameter A increases owing to a more rapid heat transfer.

Originality/value

The results provide a useful source of reference for the choice of suitable materials and cooling fluids in a variety of practical applications.

Keywords

Acknowledgements

The authors gratefully acknowledge the financial support provided to this study by the Ministry of Science and Technology of Taiwan under grant number MOST 105-2221-E-018-019.

Citation

Chen, C.K., Chang, Y.-S., Liu, C.-C. and Chen, B.-S. (2017), "Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method", Engineering Computations, Vol. 34 No. 7, pp. 2242-2255. https://doi.org/10.1108/EC-04-2017-0150

Publisher

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Emerald Publishing Limited

Copyright © 2017, Emerald Publishing Limited

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