Materials and soldering challenges in lead-free Package-on-Package (PoP) technology
Abstract
Purpose
The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes.
Design/methodology/approach
The properties and behavior of different combinations of soldering materials, PoP components and soldering profiles were investigated, both in the laboratory and during production trials. The purpose of such an approach was identification of existing problems and challenges in lead-free PoP systems assembly as well as checking which soldering material designed to PoP is more suitable for this technology.
Findings
Technological trials are needed to select adequate soldering materials for PoP systems assembly, as laboratory tests of materials alone were not sufficient. The challenges of PoP technology were associated with the equipment utilized, the soldering materials, operational parameters and the soldering profile used for assembly. The localization of defects in PoP systems is very difficult and, in many cases, destructive methods have to be used on solder joints for the assessment and confirmation of failures.
Originality/value
This paper shows main materials and soldering challenges in lead-free PoP technology. In particular, the problem related with selection of soldering materials and soldering profiles for PoP was presented. Moreover, the issues that have to be taken into consideration during the planning of a PoP system assembly procedure are presented.
Keywords
Acknowledgements
The research leading to these results has received funding from project No UDA-POIG.01.04.00-14-022/12-00.
Citation
Kościelski, M., Sitek, J., Stęplewski, W., Kozioł, G., Ciszewski, P. and Krzaczek, T. (2015), "Materials and soldering challenges in lead-free Package-on-Package (PoP) technology", Soldering & Surface Mount Technology, Vol. 27 No. 3, pp. 103-107. https://doi.org/10.1108/SSMT-03-2015-0012
Publisher
:Emerald Group Publishing Limited
Copyright © 2015, Emerald Group Publishing Limited