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Reflow profile study of the Sn‐Ag‐Cu solder

B. Salam (School of Engineering, University of Greenwich, Kent, UK)
C. Virseda (European Fuel Cell)
H. Da (School of Engineering, University of Greenwich, Kent, UK)
N.N. Ekere (School of Engineering, University of Greenwich, Kent, UK)
R. Durairaj (School of Engineering, University of Greenwich, Kent, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2004

1104

Abstract

A study of the Sn‐Ag‐Cu lead‐free solder reflow profile has been conducted. The purpose of the work was to determine the Sn‐Ag‐Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn‐Ag‐Cu lead‐free solder should be 230°C. The recommended time above liquidus is 40 s for the RSS reflow profile and 50‐70 s for the RTS reflow profile.

Keywords

Citation

Salam, B., Virseda, C., Da, H., Ekere, N.N. and Durairaj, R. (2004), "Reflow profile study of the Sn‐Ag‐Cu solder", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 27-34. https://doi.org/10.1108/09540910410517022

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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