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RLC effects in fine pitch anisotropic conductive film connections

G. Dou (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Y.C. Chan (Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, People's Republic of China)
J.E. Morris (Electrical and Computer Engineering, Portland State University, Portland, Oregon, USA)
D.C. Whalley (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 2006

455

Abstract

Purpose

The resistance, capacitance and inductance of anisotropic conductive film (ACF) connections determine their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint contributes to time delays and cross‐talk noise as well as simultaneous switching noise within the circuit. The purpose of this paper is to establish an experimental method for estimating the capacitance and inductance of a typical ACF connection. This can help to provide a more detailed understanding of the high frequency performance of ACF assemblies.

Design/methodology/approach

Experiments on the transient response of an ACF joint were performed using a digital oscilloscope capable of achieving the required ns resolution. An equivalent circuit model is proposed in order to quantify the capacitance (C) and inductance (L) of a typical ACF connection and this model is fitted to the experimental data. The full model consisted of two resistors, an inductor, and a capacitor.

Findings

The capacitance and inductance of a typical ACF connection were estimated from the measured transient response using Kirchhoff's voltage law. The method for estimation of R, L, and C from the transient response is discussed, as are the RLC effects on the high frequency electrical characteristics of the ACF connection.

Research limitations/implications

There was decay time deviation between the calculation and the experiment. It may have resulted from the skin effect in the high frequency response and the adhesive surrounding joint as well. The main reason may be the capacitance zctric lost. Further research work will be done to determine more accurately the dielectric losses in anisotropic conductive adhesive (ACA) joint.

Originality/value

This paper presents a new method to characterise the high frequency properties of ACA interconnections and will be of use to engineers evaluating the performance of ACF materials in high frequency applications.

Keywords

Citation

Dou, G., Chan, Y.C., Morris, J.E. and Whalley, D.C. (2006), "RLC effects in fine pitch anisotropic conductive film connections", Soldering & Surface Mount Technology, Vol. 18 No. 1, pp. 3-10. https://doi.org/10.1108/09540910610647062

Publisher

:

Emerald Group Publishing Limited

Copyright © 2006, Emerald Group Publishing Limited

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