To read this content please select one of the options below:

Hardness testing of lead-free solders: a review

Muhamad Zamri Yahaya (School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal, Malaysia)
Ahmad Azmin Mohamad (School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 4 September 2017

460

Abstract

Purpose

This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers microhardness, Brinell microhardness and nanoindentation.

Design/methodology/approach

A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each technique and discussed in parallel along with the case studies from selected articles.

Findings

Comparison, outcomes and insight regarding each of the methods were highlighted to observe the recent trends, scientific challenges, limitations and probable breakthroughs of the particular hardness testing methods.

Originality/value

The compilation of latest reports, technical setup plus with the critics and perception from the authors are the main key value in this review. This provides an in-depth understanding and guidance for conducting hardness evaluation on lead-free solders.

Keywords

Citation

Yahaya, M.Z. and Mohamad, A.A. (2017), "Hardness testing of lead-free solders: a review", Soldering & Surface Mount Technology, Vol. 29 No. 4, pp. 203-224. https://doi.org/10.1108/SSMT-01-2017-0002

Publisher

:

Emerald Publishing Limited

Copyright © 2017, Emerald Publishing Limited

Related articles