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Solder paste volume effects on assembly yield and reliability for bottom terminated components

Sai Srinivas Sriperumbudur (Rochester Institute of Technology, Rochester, New York, USA)
Michael Meilunas (AREA Consortium, Universal Instruments Corporation, Conklin, New York, USA)
Martin Anselm (Rochester Institute of Technology, Rochester, New York, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 3 April 2017

299

Abstract

Purpose

Solder paste printing is the most common method for attaching surface mount devices to printed circuit boards (PCB), and it has been reported that a majority of all assembly defects occur during the stencil printing process. It is also recognized that the solder paste printing process is wholly responsible for the solder joint formation of leadless package technologies such as land grid array (LGA) and quad-flat no-lead (QFN) components and therefore is a determining factor in the long-term reliability of said devices. The aim of this experiment is to determine the acceptable lower limit for solder paste volume deposit tolerances during stencil printing process to ensure both good assembly yield and reliability expectations.

Design/methodology/approach

Stencils with modified aperture dimensions at particular locations for LGA and QFN package footprints were designed to vary the solder paste volume deposited during the stencil printing process. Solder paste volumes were measured using solder paste inspection system. Low volume solder paste deposits were generated using the modified stencil designs to evaluate assemble yield. Accelerated thermal cycling (ATC) was used to determine the reliability of the solder joints. Failure analysis was used to determine if the failure was attributed to the low paste volume locations.

Findings

Solder joints formed with nominal paste volume survived longer in ATC compared to intentionally low volume joints. Transfer efficiency numbers for both good assembly yield and good reliability are reported for LGA and QFN devices. A lower volume limit is reported for leadless devices that should not significantly affect yield and reliability in thermal cycling.

Originality/value

Very little literature is available on solder paste volume tolerance limits in terms of assembly yield and reliability. Manufacturers often use ±50 or ±30 per cent of stencil aperture volume with no evidence of its effectiveness in determining yield and reliability of the solder joints.

Keywords

Acknowledgements

The authors would like to acknowledge and thank the AREA Consortium at Universal Instruments Corporation for providing the funding and support for the project.

Citation

Sriperumbudur, S.S., Meilunas, M. and Anselm, M. (2017), "Solder paste volume effects on assembly yield and reliability for bottom terminated components", Soldering & Surface Mount Technology, Vol. 29 No. 2, pp. 99-109. https://doi.org/10.1108/SSMT-05-2016-0010

Publisher

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Emerald Publishing Limited

Copyright © 2017, Emerald Publishing Limited

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