Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications

Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications

Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications

Keywords Siemens, Dies, Placement

Siemens has announced the launch of a new direct die feeder (DDF) system that can be integrated with their SIPLACE printed circuit board (PCB) assembly machines. Targeted at OEMs and contract manufacturers with advanced component placement requirements, this system allows mainstream manufacturing of bare die applications, including COB and flip chip.

The DDF dramatically reduces production costs by eliminating the packaging costs associated with tape-and-reel and waffle pack formats. This cost reduction is possible simply because the feeder picks the bare die directly from the wafer. As a result, both the numbers of vendors required to prepare the components as well as component delivery lead-times are decreased.

The DDF can be integrated with both high-speed and flexible, fine pitch SIPLACE machines, thus providing complete flexibility when implementing any type of bare die application in manufacturing. For high accuracy applications, the DDF can be mounted on a SIPLACE 80 F5; for high throughput applications, the DDF can be used with the SIPLACE 80 S 20. This range of flexibility surpasses the range offered by both systems that are currently available in the market, which can only be mounted to flexible fine pitch assembly machines.

The Siemens DDF solution uses only a minimal amount of space on a SIPLACE component feeder table, because the wafer is situated on a vertical axis. Since it occupies only three feeder locations on the feeder table, the SIPLACE machine can place other components in addition to a bare die.

The DDF accommodates wafers in sizes ranging from 100mm to 200mm, handling individual die from 1mm to 5mm. The maximum placement rate is 2,400 flip chip per hour, and 3,400 COB per hour.

For further information please contact: Madeline Pedley, Siemens Automation ­ SMT. Tel: +44 (0)161 446 6645; Fax: +44 (0)161 446 5280; E-mail: pedleym@plcman.siemens.co.uk; Web: www.siemens-industry.co.uk