Citation
(2002), "Asymtek contributes advanced semiconductor applications technology to KAIST University", Soldering & Surface Mount Technology, Vol. 14 No. 3. https://doi.org/10.1108/ssmt.2002.21914cab.008
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Asymtek contributes advanced semiconductor applications technology to KAIST University
Asymtek contributes advanced semiconductor applications technology to KAIST University
Asymtek and the Micro-Electronic Packaging Lab (MEPL) of the Korea Advanced Institute of Science and Technology (KAIST) in Daejon, Korea have renewed their 2 year agreement to jointly support dispensing reliability studies for semiconductor packaging applications. This collaboration enables the investigation of new and innovative methods of semiconductor packaging technologies.
An Asymtek Century* C-720 system is currently in use at KAIST's
Micro-Electronic Packaging Laboratory, where several companies are conducting dispensing tests of under fill materials, solder bump reliability, and the development of flip chip applications. The Century system provides exceptional dispensing accuracy and reliability for under fill, dam and fill, cavity fill, die attach, encapsulation and other semiconductor applications.
KAIST's mission (www.KAIST.ac.kr) as a government-sponsored research oriented institute is to educate world-class scientists and engineers, and also to develop leading edge technologies for Korea's high-tech industries.