Anisotropic conducting adhesives for electronic assembly

Abstract

Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using anisotropic conductive adhesive materials. The experimental configurations studies have geometries representative of flip‐chip and micro ball grid array chip scale packaging. Evaluates a range of materials combinations, including (random filled) adhesive materials based on both thermoplastic and thermo‐setting resin systems, combined with both glass reinforced polymer printed circuit board and silver palladium thick film on ceramic substrate materials. Also presents a summary of assembly experiments which have been conducted using a specially developed instrumented assembly system. This test rig allows the measurement of the process temperatures and pressures and their relationship with the consequent bondline thickness reduction and conductivity development. Finally summarizes the capabilities of models which have been developed of the assembly process and of the final joint properties.

Citation

Whalley, D.C., Mannan, S.H. and Williams, D.J. (1997), "Anisotropic conducting adhesives for electronic assembly", Assembly Automation, Vol. 17 No. 1, pp. 66-74. https://doi.org/10.1108/01445159710163481