Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass‐production and packaging manufacturers?

Abstract

Purpose

To give an overview of the main needs of PCB manufacturers and to show how these needs can be met using laser direct imaging (LDI) technology.

Design/methodology/approach

This paper has been written to provide a review of current needs of PCB manufacturers in different product types. Problem areas are highlighted and methods for solving these issues using LDI technology are described.

Findings

Demand for LDI machines is increasing globally. Enhancements in LDI technology capabilities are convincing more PCB companies to the technology in today's production. HDI can address the needs of different applications such as: quick turnaround and sampling jobs that require short delivery times while meeting high technological demands; high layer count jobs that require accurate layer to layer alignment; flex and rigid‐flex boards with challenging registration and exposure uniformity demands; and sequential build‐up boards that require very accurate pad to hole registration, etc.

Originality/value

The paper provides information on the type of problems and issues encountered by PCB manufacturers in different applications. It also details the current and near future developments in LDI technology that will enable PCB manufacturers to address these issues.

Citation

Altmann, U. (2006), "Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass‐production and packaging manufacturers?", Circuit World, Vol. 32 No. 4, pp. 15-18. https://doi.org/10.1108/03056120610683568