Failure analysis of electronic components and interconnection systems
Abstract
Purpose
The failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed.
Design/methodology/approach
How the analytical techniques used for physical and chemical analysis, which include X‐ray radiography, optical microscopy and scanning electron microscopy/energy dispersive X‐ray spectroscopy, are used.
Findings
Examples from recent case studies are given to illustrate the work.
Originality/value
The paper demonstrates how the failure analysis of an electronic component or interconnection system is conducted, and what can be learnt from the investigation.
Keywords
Citation
Smith, C.A. (2007), "Failure analysis of electronic components and interconnection systems", Circuit World, Vol. 33 No. 1, pp. 15-21. https://doi.org/10.1108/03056120710723670
Publisher
:Emerald Group Publishing Limited
Copyright © 2007, Emerald Group Publishing Limited