Selection and qualification of polymers for rigid and flexible interconnect applications

Abstract

Purpose

This paper seeks to give an overview on the benefits and challenges of moulded interconnect devices‐technology and the use of flexible printed circuits (FPC) in electronics production.

Design/methodology/approach

Each process step was adapted to the boundary conditions of manufacturing three‐dimensional substrates and FPC. The substrate materials were examined under the specific requirements of electronics production with a special focus on the thermal stability of the materials and the adhesiveness of the metallization.

Findings

The use of thermoplastics as substrate materials for electronic devices offers high potential but new challenges, e.g. the higher coefficient of thermal expansion of thermoplastics, have to be taken into consideration as well. In most cases, standard machines for surface mount technology can be used with few modifications. Research has shown that even components with very fine pitches can be used successfully on alternative substrate materials.

Research limitations/implications

The paper covers a selection of possible thermoplastic materials that can be used in electronics production. Depending on the requirements of the application and the operating environment other substrate materials open up a large variety of possible solutions.

Originality/value

The paper details the most promising thermoplastic materials for use in electronics production as rigid and FPC. Furthermore, it gives information about manufacturing guidelines for the production of three‐dimensional circuit carriers.

Citation

Schuessler, F., Feldmann, K. and Bigl, T. (2007), "Selection and qualification of polymers for rigid and flexible interconnect applications", Circuit World, Vol. 33 No. 2, pp. 36-42. https://doi.org/10.1108/03056120710750247