Halogen‐free materials with improved thermal and electrical properties

Abstract

Purpose

The purpose of this paper is to present a latest update on halogen‐free base materials that are lead‐free compatible and have enhanced electrical properties.

Design/methodology/approach

Numerous halogen‐free flame retardants are screened in laboratory conditions for a wide arrange of properties. Once suitable candidates are found, they are compounded and processed into copper‐clad laminates and a wide variety of properties are tested.

Findings

Several formulations are found that are lead‐free compatible and that has enhanced electrical properties. Surprisingly, some thermal properties are found to be superior to traditionally halogenated laminates.

Research limitations/implications

The research here only presents the halogen‐free properties of a bare, unpopulated printed wiring board with no build up of inner layers and devoid of solder mask. Further work needs to be done on full circuit assemblies to properly evaluate the impact of removing halogens from interconnecting packages.

Originality/value

The paper details the material property differences between various halogen‐free materials as compared to halogenated materials. A method to model composite properties is also discussed.

Citation

Bedner, D. and He, M. (2009), "Halogen‐free materials with improved thermal and electrical properties", Circuit World, Vol. 35 No. 3, pp. 3-7. https://doi.org/10.1108/03056120910979486