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Hybridization of volumetric and surface models for the computation of the T/R EC probe response due to a thin opening flaw

Léa Maurice (CEA LIST Saclay, Gif‐sur‐Yvette, France)
Denis Prémel (CEA LIST Saclay, Gif‐sur‐Yvette, France)
József Pávó (Budapest University of Technology and Economics, Budapest, Hungary)
Dominique Lesselier (Laboratory of Signals and Systems, Department of Research in Electromagnetics)
Alain Nicolas (Centrale Lyon, Ecully, France)
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Abstract

Purpose

The purpose of this paper is to describe the development of simulation tools dedicated to eddy current non destructive testing (ECNDT) on planar structures implying planar defects. Two integral approaches using the Green dyadic formalism are considered.

Design/methodology/approach

The surface integral model (SIM) is dedicated to ideal cracks, whereas the volume integral method is adapted to general volumetric defects.

Findings

The authors observed that SIM provides satisfactory results, except in some critical transmitting/receiving (T/R) configurations. This led us to propose a hybrid method based on the combination of the two previous ones.

Originality/value

This method enables to simulate ECNDT on planar structures implying defects with a small opening using T/R probes.

Keywords

Citation

Maurice, L., Prémel, D., Pávó, J., Lesselier, D. and Nicolas, A. (2008), "Hybridization of volumetric and surface models for the computation of the T/R EC probe response due to a thin opening flaw", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 27 No. 1, pp. 298-306. https://doi.org/10.1108/03321640810836852

Publisher

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Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited

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