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Lead‐free solder process implementation for PCB assembly

Peter Collier (Process Technology Division, Surface Technology Group, Singapore Institute of Manufacturing Technology (SIMTech), 71 Nanyang Drive, Singapore, 638075)
Vasudivan Sunappan (Technology Transfer Division, Electronics Packaging Department, Singapore Institute of Manufacturing Technology (SIMTech), 71 Nanyang Drive, Singapore, 638075)
Arulvanan Periannan (Technology Transfer Division, Electronics Packaging Department, Singapore Institute of Manufacturing Technology (SIMTech), 71 Nanyang Drive, Singapore, 638075)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2002

641

Abstract

A challenge in selecting and applying lead‐free solders lies in separating the influences of materials' properties, fluxes and processes to obtain robust assembly conditions that are compatible with PCB finishes and all component terminations. This paper discusses simple steps towards establishing a lead‐free assembly process. With reference to results of solder paste spread and wetting tests and component solderability tests, some of the current limitations in applying standard test methods to lead‐free evaluations are highlighted.

Keywords

Citation

Collier, P., Sunappan, V. and Periannan, A. (2002), "Lead‐free solder process implementation for PCB assembly", Soldering & Surface Mount Technology, Vol. 14 No. 3, pp. 12-18. https://doi.org/10.1108/09540910210444674

Publisher

:

MCB UP Ltd

Copyright © 2002, MCB UP Limited

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