Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders
Abstract
Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead‐free solder joints for various assembly conditions. A five‐leg experiment was designed which included various combinations of solder materials and peak reflow temperatures. It was found that the lead‐free solder joints have a much longer thermal fatigue life than the 63Sn–37Pb solder. The 63Sn–37Pb solder joints seem to perform slightly better than the lead‐free solder under mechanical loading.
Keywords
Citation
Ricky Lee, S., Hoi Wai Lui, B., Kong, Y.H., Baylon, B., Leung, T., Umali, P. and Agtarap, H. (2002), "Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders", Soldering & Surface Mount Technology, Vol. 14 No. 3, pp. 46-50. https://doi.org/10.1108/09540910210444728
Publisher
:MCB UP Ltd
Copyright © 2002, MCB UP Limited