Finite element analysis of a three‐dimensional package
Zhaowei Zhong
(Nanyang Technological University, Singapore)
Peng Kiong Yip
(Nanyang Technological University, Singapore)
1113
Abstract
A three‐dimensional (3D) package consisting of a stack of three silicon chips was conceptually designed. A finite element simulation of this 3D package was conducted in order to compare the fatigue lives of the solder joints with those in a typical single flip chip package when subjected to a cyclic thermal loading. It was found that the proposed design of the 3D package was feasible in terms of its mechanical deformation response to the thermal cycle.
Keywords
Citation
Zhong, Z. and Kiong Yip, P. (2003), "Finite element analysis of a three‐dimensional package", Soldering & Surface Mount Technology, Vol. 15 No. 1, pp. 21-25. https://doi.org/10.1108/09540910310455680
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited