Fine pitch stencil printing using enclosed printing systems

Abstract

Enclosed print heads have recently been developed as an improvement on the traditional squeegee methods for solder paste printing. They offer the opportunity of widening the printing process window and reducing process waste. Consequently, this work was undertaken to evaluate some aspects of enclosed print head printing, and it has been shown to be a robust process. A number of performance factors were established: with increased humidity the paste degradation was limited due to its sealed paste reservoir; the system also permitted successful intermittent printing over a 5 day period; printing is much more tolerant to distorted substrates than some squeegee blades, and hence improves printing on non‐planar surfaces; significant reduction in paste wastage occurs, since paste ageing is reduced.

Citation

Chunxian Zou, L., Dusek, M., Wickham, M. and Hunt, C. (2003), "Fine pitch stencil printing using enclosed printing systems", Soldering & Surface Mount Technology, Vol. 15 No. 1, pp. 43-49. https://doi.org/10.1108/09540910310455725