Application of a design of experiments approach to the reliability of a PBGA package

Abstract

Purpose

To apply the design of experiments (DOE) methodology to the problem of cracking of plastic ball grid array (PBGA) packages during the reflow soldering process.

Design/methodology/approach

The DOE methodology was used in order to identify the optimum design. CAE was used for the required stress analysis and for integral calculation during crack analysis.

Findings

The optimum design to reduce the stress and fracture probability for the PBGA package was obtained and the DOE technique was shown to be very powerful for establishing the optimum design when there are many design parameters.

Research limitations/implications

In future research, a robust design methodology could be applied including design for six sigma considering the noise parameters.

Practical implications

For better design of a PBGA package, the DOE methodology has been shown to be very useful.

Originality/value

In this paper, application of the DOE approach to a PBGA package design in order to reduce the stresses and probability of fracture was attempted for the first time.

Citation

Hyuck Yang, J. and Yong Lee, K. (2005), "Application of a design of experiments approach to the reliability of a PBGA package", Soldering & Surface Mount Technology, Vol. 17 No. 3, pp. 43-53. https://doi.org/10.1108/09540910510613547