Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Abstract

Purpose

The purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd pads using SnAgCu or SnPb solder and the results of the characterization of the solder joints.

Design/methodology/approach

LTCC substrates were fabricated by stacking and laminating four green tapes with the top layer screen‐printed with Ag or AgPd paste to form pads. Silicon die sizes of 1 × 1 mm and 2 × 2 mm with electroless nickel immersion gold plated were soldered to 2 × 2 mm pads on the LTCC substrates using SnPb or SnAgCu solder. The solder joints were then characterized using X‐ray, die shear, energy dispersive X‐ray and scanning electron microscopy techniques.

Findings

The joints made by AgPd pads with SnAgCu solder provided the best results with the highest shear strength having strong interfaces in the joints. However, the joints of Ag pads with SnPb solder did not provide high‐shear strength.

Originality/value

The findings provide certain guidelines to implement LTCC applications. AgPd pads with SnAgCu solder can be considered for applications where small silicon dies need to be attached to LTCC substrates. However, Ag pads with SnAgCu solder can be considered for lead‐free solder applications.

Citation

Zhong, Z.W., Arulvanan, P., Phone Maw, H. and Lu, C.W.A. (2007), "Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate", Soldering & Surface Mount Technology, Vol. 19 No. 4, pp. 18-24. https://doi.org/10.1108/09540910710848518