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Influences of storage conditions on component cracking

Klaus Feldmann (Institute for Manufacturing Automation and Production Systems (FAPS), University Erlangen‐Nuremberg, Erlangen, Germany)
Robert Feuerstein (Institute for Manufacturing Automation and Production Systems (FAPS), University Erlangen‐Nuremberg, Erlangen, Germany)
Knuth Götz (Institute for Manufacturing Automation and Production Systems (FAPS), University Erlangen‐Nuremberg, Erlangen, Germany)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 1998

759

Abstract

At the Institute for Manufacturing Automation and Production Systems (FAPS), in Erlangen, Germany, the influence of different storage conditions on cracking behaviour of high‐pin‐count components is examined. The aim is to register all relevant influence parameters in an expanded‐damage model and to quantify its effects on the later processing of the components. Effective strategies can be developed, based on this new model of damage, for storage and transportation of components.

Keywords

Citation

Feldmann, K., Feuerstein, R. and Götz, K. (1998), "Influences of storage conditions on component cracking", Soldering & Surface Mount Technology, Vol. 10 No. 3, pp. 6-11. https://doi.org/10.1108/09540919810237020

Publisher

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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