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Thermal regulating functional performance of PCM garments

Ying Bo‐an (Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hong Kong, People’s Republic of China)
Kwok Yi‐Lin (Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hong Kong, People’s Republic of China)
Li Yi (Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hong Kong, People’s Republic of China)
Yeung Chap‐Yung (Department of Paediatrics and Adolescent Medicine, The University of Hong Kong, Hong Kong, People’s Republic of China)
Song Qing‐wen (Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hong Kong, People’s Republic of China)

International Journal of Clothing Science and Technology

ISSN: 0955-6222

Article publication date: 1 February 2004

1111

Abstract

By analysing the physical mechanisms of heat and moisture transfer through textiles with PCM and carrying out the test of thermal regulating functional performance of PCM garment in climate chamber, the thermal regulating functional performance of PCM garments have been analysed and discussed in this paper. Both numerical solution and experimental results show that during the phase change process the rate of temperature rise of garment with higher PCM add‐on level was lower than that with less PCM. From theoretical analysis and experiment curve, the parameter of k was proposed and discussed, which is used to represent the rate of temperature change and the thermal regulating functional performance of PCM garments. It has been demonstrated that the higher the PCM add‐on level contained in the garment, the lower is the value of k, and slower the temperature raised in the garment, the higher is the effect of thermal regulating.

Keywords

Citation

Bo‐an, Y., Yi‐Lin, K., Yi, L., Chap‐Yung, Y. and Qing‐wen, S. (2004), "Thermal regulating functional performance of PCM garments", International Journal of Clothing Science and Technology, Vol. 16 No. 1/2, pp. 84-96. https://doi.org/10.1108/09556220410520388

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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