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Selective laser melting of heat transfer devices

Matthew Wong (The University of Liverpool, Liverpool, UK)
Sozon Tsopanos (The University of Liverpool, Liverpool, UK)
Chris J. Sutcliffe (The University of Liverpool, Liverpool, UK)
Ieuan Owen (The University of Liverpool, Liverpool, UK)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 2 October 2007

3916

Abstract

Purpose

To fabricate and characterise novel heat sinks manufactured by selective laser melting (SLM). The investigation explores features of SLM produced heat sinks that may be exploited to improve their heat transfer capability.

Design/methodology/approach

The study was conducted on heat sinks manufactured from 316L stainless steel and aluminium 6061. The heat transfer devices' thermal and pressure drop performances were determined by experimental test.

Findings

The research demonstrates the performance enhancements that can be realised by using novel heat sink designs, fabricated by SLM, over conventional pin fin arrays. aluminium 6061 is used with the process to illustrate the improvement in heat transfer provided by higher conductivity feedstock materials.

Research limitations/implications

Although the manufacturing technique is still in the development stage and the heat transfer devices that have so far been manufactured should not be considered optimal, the potential for creative new designs and applications is clear. This study highlights the need to develop the SLM process parameters to allow the repeatable production of heat transfer devices from higher conductivity metals with controllable surface finishes.

Originality/value

This paper outlines the design issues and performance of novel heat transfer devices fabricated using SLM. A new material, aluminium 6061, is introduced to the family of materials that can be processed with SLM and example heat sinks are tested.

Keywords

Citation

Wong, M., Tsopanos, S., Sutcliffe, C.J. and Owen, I. (2007), "Selective laser melting of heat transfer devices", Rapid Prototyping Journal, Vol. 13 No. 5, pp. 291-297. https://doi.org/10.1108/13552540710824797

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited

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