Over‐infiltration mechanisms in selective laser sintered Si/SiC preforms
Abstract
Purpose
The paper aims to evaluate mechanisms for silicon overfilling including volume expansion of silicon on solidification for composite silicon/silicon carbide (SiC) objects generated using post‐process infiltration of selective laser sintered (SLS) SiC preforms.
Design/methodology/approach
Overfilling was characterized through geometrical means and microscopy, and results were used for further study and discussion of overfilling mechanisms.
Findings
Silicon overfilling in silicon infiltrated SLS SiC parts is attributed primarily to its infiltrant silicon volume expansion on solidification. Si/SiC composites were found to be thermally stable with good material bonding.
Research limitations/implications
Silicon as an infiltrant is unusual as it expands on solidification, whereas most infiltrants contract. Overfilling during infiltration of SLS porous performs is therefore not considered to be prevalent.
Originality/value
This paper provides an examination of the value of silicon as an infiltrant material for SLS SiC preforms. Various mechanisms are presented for volume change during post‐process infiltration of indirect SLS non‐metallic performs.
Keywords
Citation
Stevinson, B., Bourell, D.L. and Beaman, J.J. (2008), "Over‐infiltration mechanisms in selective laser sintered Si/SiC preforms", Rapid Prototyping Journal, Vol. 14 No. 3, pp. 149-154. https://doi.org/10.1108/13552540810878003
Publisher
:Emerald Group Publishing Limited
Copyright © 2008, Emerald Group Publishing Limited