Advanced
search

To read this content please select one of the options below:

Measurements and simulation of SMT components

Ryszard J. Pryputniewicz (NEST – NanoEngineering, Science and Technology, CHSLT – Center for Holographic Studies and Laser micro‐mechaTronics, Worcester Polytechnic Institute, Worcester, MA, USA)
David Rosato (NEST – NanoEngineering, Science and Technology, CHSLT – Center for Holographic Studies and Laser micro‐mechaTronics, Worcester Polytechnic Institute, Worcester, MA, USA)
Cosme Furlong (NEST – NanoEngineering, Science and Technology, CHSLT – Center for Holographic Studies and Laser micro‐mechaTronics, Worcester Polytechnic Institute, Worcester, MA, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003

286

Abstract

Integrity of surface mount technology (SMT) components depends on their response to temperature changes caused by operating conditions. Temperature induced differential thermal expansions lead to strains in the interconnection structures of active devices. To evaluate these strains, temperature profiles of the interconnected components must be known. In this paper, a methodology for developing thermal models of SMT components is presented using thermal analysis system (TAS) and its application is demonstrated by simulating thermal fields of a representative package. Then, thermomechanical deformations of the package are measured quantitatively using state‐of‐the‐art laser‐based optoelectronic holography (OEH) methodology.

Keywords

Citation

Pryputniewicz, R.J., Rosato, D. and Furlong, C. (2003), "Measurements and simulation of SMT components", Microelectronics International, Vol. 20 No. 1, pp. 13-16. https://doi.org/10.1108/13565360310455463

Publisher

:

MCB UP Ltd

Copyright © 2003, MCB UP Limited

Related articles

Manage cookies

We’re listening — tell us what you think

Join us on our journey