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Simulation of the mechanical behavior of self-healing composite materials

Evgenia Madia (Department of Mechanical Engineering and Aeronautics, University of Patras, Patras, Greece)
Konstantinos Tserpes (Department of Mechanical Engineering and Aeronautics, University of Patras, Patras, Greece)
Panagiota Polydoropoulou (Department of Mechanical Engineering and Aeronautics, University of Patras, Patras, Greece)
Spyros Pantelakis (Department of Mechanical Engineering and Aeronautics, University of Patras, Patras, Greece)

Aircraft Engineering and Aerospace Technology

ISSN: 0002-2667

Article publication date: 8 August 2022

Issue publication date: 9 September 2022

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Abstract

Purpose

The purpose of this study is the investigation of self-healing materials containing encapsulated healing agents embedded in a polymer matrix with dispersed catalysts. In recent years, the high performance and design flexibility of composite materials have led to their widespread use in the aeronautics, space, automotive and marine fields. Simultaneously, as the need for advanced material properties has increased, many studies have been conducted on multifunctional materials, focusing on different fields of their desired capabilities.

Design/methodology/approach

A multiscale model was developed to simulate the effect of microcapsules on the mechanical behavior of the polymer matrix. Furthermore, the effects of microcapsule diameter and microcapsule concentration on the mechanical behavior of the composite were studied. Digimat and Ansys software were used to simulate the self-healing composites.

Findings

There is a trade-off between the efficiency of the microcapsules and the degradation of the properties of the composite material.

Originality/value

The generated model simulated an encapsulated healing agent in a polymeric matrix.

Keywords

Citation

Madia, E., Tserpes, K., Polydoropoulou, P. and Pantelakis, S. (2022), "Simulation of the mechanical behavior of self-healing composite materials", Aircraft Engineering and Aerospace Technology, Vol. 94 No. 9, pp. 1567-1576. https://doi.org/10.1108/AEAT-02-2022-0036

Publisher

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Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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